EP2AGX125DF25C5NES

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Mfr.Part #
EP2AGX125DF25C5NES
Manufacturer
Altera (Intel)
Package / Case
572-BGA, FCBGA
Datasheet
Download
Description
IC FPGA 260 I/O 572FBGA
Stock
8,028
In Stock :
8,028

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
JESD-30 Code :
S-PBGA-B572
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of I/O :
260
Total RAM Bits :
8315904
Number of Terminations :
572
ECCN Code :
3A991
Reach Compliance Code :
Compliant
Number of Logic Elements/Cells :
118143
Package / Case :
572-BGA, FCBGA
HTS Code :
8542.39.00.01
Packaging :
Tray
Height Seated (Max) :
2.2mm
Number of LABs/CLBs :
4964
Organization :
124100 CLBS
Operating Temperature :
0°C~85°C TJ
Qualification Status :
Not Qualified
Length :
25mm
Width :
25mm
Clock Frequency :
500MHz
Voltage - Supply :
0.87V~0.93V
Series :
Arria II GX
Terminal Position :
BOTTOM
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Mounting Type :
Surface Mount
Number of CLBs :
124100
Supply Voltage :
0.9V
Terminal Pitch :
1mm
Surface Mount :
yes
Terminal Form :
Ball
Base Part Number :
EP2AGX125
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EP2AGX125DF25C5NES from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:572, Package / Case:572-BGA, FCBGA, Operating Temperature:0°C~85°C TJ, Mounting Type:Surface Mount, Base Part Number:EP2AGX125, EP2AGX125DF25C5NES pinout, EP2AGX125DF25C5NES datasheet PDF, EP2AGX125DF25C5NES amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EP2AGX125DF25C5NES ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EP2AGX125DF25C5NES


FPGAs Altera EP2AGX125DF25C5NES Overview

The EP2AGX125DF25C5NES, manufactured by Altera (Intel), represents a pinnacle in the evolution of Field Programmable Gate Arrays (FPGAs). Designed to meet the demanding requirements of high-speed digital processing, this IC FPGA integrates advanced features with a flexible architecture. With its substantial logic density and configurable technology, the EP2AGX125DF25C5NES is an ideal solution for developers aiming to accelerate product development cycles while maintaining the ability to iterate designs based on evolving system requirements. Its 572-pin FBGA (Fine-pitch Ball Grid Array) packaging ensures robust physical integration and connectivity, enhancing its reliability and performance in complex electronic assemblies.

EP2AGX125DF25C5NES Features

This FPGA features 260 programmable I/O pins, which provide ample flexibility for a variety of digital interfacing requirements. The device's high-speed transceivers enable significant data throughput, making it suitable for high-performance applications that require rapid data processing and transfer. The integration of power-efficient design practices within the chip ensures that the EP2AGX125DF25C5NES is also suitable for power-sensitive applications, maintaining optimal performance while minimizing power consumption.

EP2AGX125DF25C5NES Applications

  • Telecommunications: Employed in the development of routers, switches, and other network infrastructure equipment, where high-speed signal processing and data integrity are critical.
  • Automotive Electronics: Utilized in advanced driver-assistance systems (ADAS) to process multiple inputs from vehicle sensors, enhancing safety and driving capabilities.
  • Consumer Electronics: Integral to the creation of multimedia home entertainment systems, offering the necessary processing power to handle complex video and audio decoding.
  • Industrial Automation: Applied in the control systems of manufacturing robots and other automated machinery, where precise, real-time operations are essential.
  • Medical Devices: Used in the imaging and diagnostic equipment to facilitate real-time data processing and visualization, crucial for accurate diagnostics.
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