EP1C4F324C7

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Mfr.Part #
EP1C4F324C7
Manufacturer
Altera (Intel)
Package / Case
324-BGA
Datasheet
Download
Description
IC FPGA 249 I/O 324FBGA
Stock
644
In Stock :
644

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Number of LABs/CLBs :
400
Base Part Number :
EP1C4
RoHS Status :
Non-RoHS Compliant
Number of Inputs :
301
Time@Peak Reflow Temperature-Max (s) :
30
Number of Logic Elements/Cells :
4000
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Supply Voltage :
1.5V
Terminal Form :
Ball
Number of Terminations :
324
Mounting Type :
Surface Mount
Packaging :
Tray
Terminal Finish :
Tin/Lead (Sn/Pb)
JESD-30 Code :
S-PBGA-B324
HTS Code :
8542.39.00.01
Series :
Cyclone®
Operating Temperature :
0°C~85°C TJ
Height Seated (Max) :
2.2mm
Number of Outputs :
301
Width :
19mm
Surface Mount :
yes
Package / Case :
324-BGA
Voltage - Supply :
1.425V~1.575V
Length :
19mm
Qualification Status :
Not Qualified
Number of I/O :
249
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Power Supplies :
1.51.5/3.3V
Terminal Pitch :
1mm
Peak Reflow Temperature (Cel) :
220
Clock Frequency :
320MHz
JESD-609 Code :
e0
Terminal Position :
BOTTOM
Total RAM Bits :
78336
Datasheets
EP1C4F324C7
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EP1C4F324C7 from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:EP1C4, Number of Terminations:324, Mounting Type:Surface Mount, Operating Temperature:0°C~85°C TJ, Package / Case:324-BGA, EP1C4F324C7 pinout, EP1C4F324C7 datasheet PDF, EP1C4F324C7 amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EP1C4F324C7 ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EP1C4F324C7


FPGAs (Field Programmable Gate Array) Altera (Intel) EP1C4F324C7 Overview

The FPGAs (Field Programmable Gate Array) Altera (Intel) EP1C4F324C7 represents a cornerstone in advanced integrated circuit technology by Intel. Engineered to deliver exceptional performance, this FPGA leverages the robust 324-pin FBGA (Fine-pitch Ball Grid Array) packaging to achieve superior integration and scalability. As a product designed to handle complex digital computations, it is ideally suited for applications that require high-speed signal processing and data management. Its versatility is further enhanced by a high count of 249 I/Os, making it a pivotal solution for developers aiming to build high-performance systems in telecommunications, automotive, and industrial sectors.

EP1C4F324C7 Features

This FPGA stands out with its extensive set of features which include a high I/O pin count of 249, providing ample flexibility for complex designs. The 324FBGA packaging not only ensures a compact footprint but also enhances thermal management and device reliability under varying operational conditions. These characteristics make the EP1C4F324C7 an ideal choice for designers seeking advanced capabilities in hardware acceleration and system integration.

EP1C4F324C7 Applications

  • Telecommunications Equipment: Utilizes its high I/O capacity and processing power to manage data flows and signal processing, enhancing bandwidth and reducing latency in networks.
  • Automotive Electronics: Applied in driver assistance systems, it supports real-time sensor data processing and integration, contributing to safer and smarter vehicle functionalities.
  • Industrial Automation: Drives complex control systems and machinery by performing rapid computations and reliable operations in harsh environments.
  • Consumer Electronics: Powers devices requiring fast processing capabilities, such as smart home devices and high-definition multimedia interfaces.
  • Medical Devices: Used in diagnostic and monitoring equipment, ensuring precise control and processing for critical healthcare applications.
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