EMC13DRTN

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Mfr.Part #
EMC13DRTN
Manufacturer
Sullins Connector Solutions
Package / Case
Datasheet
Download
Description
CONN EDGE DUAL FMALE 26POS 0.100
Stock
21,669
In Stock :
21,669

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Manufacturer :
Sullins Connector Solutions
Product Category :
Edgeboard Connectors
JESD-609 Code :
e4
Mount :
Through Hole
Contact Type :
Full Bellows
RoHS Status :
ROHS3 Compliant
Body Depth :
0.431 inch
Body/Shell Style :
Receptacle
Color :
Blue
Termination :
Solder
Number Of PCB Rows :
2
Number of Positions/Bay/Row :
13
Rated Current (Signal) :
3A
Body Breadth :
0.33 inch
Contact Finish :
Gold
PCB Contact Row Spacing :
3.556 mm
Reference Standard :
UL, CSA
Material - Insulation :
Polybutylene Terephthalate (PBT)
Additional Feature :
NONE
Factory Lead Time :
3 Weeks
ECCN Code :
EAR99
Published :
2016
Number of Rows :
2
Number of Conductors :
ONE
Total Number of Contacts :
26
Body Length or Diameter :
1.575 inch
Pitch :
0.100 2.54mm
Contact Finish Thickness :
30.0μin 0.76μm
Dielectric Withstanding Voltage :
600VDC V
Card Thickness :
0.062 1.57mm
Moisture Sensitivity Level (MSL) :
Not Applicable
Lead Free :
Lead Free
Pbfree Code :
yes
HTS Code :
8536.69.40.40
Reliability :
COMMERCIAL
Read Out :
Dual
Contact Resistance :
10MOhm
Number of Positions :
26
Card Type :
Non Specified - Dual Edge
Operating Temperature :
-65°C~125°C
PCB Contact Pattern :
RECTANGULAR
Insulation Resistance :
5000000000Ohm
Contact Material :
Phosphor Bronze
Mounting Type :
Through Hole
Gender :
FEMALE
Packaging :
Tube
Connector Type :
Full Bellows
Plating Thickness :
30μin
Datasheets
EMC13DRTN
Introducing Edgeboard Connectors Sullins Connector Solutions EMC13DRTN from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-65°C~125°C, Mounting Type:Through Hole, EMC13DRTN pinout, EMC13DRTN datasheet PDF, EMC13DRTN amp .Beyond Edgeboard Connectors Sullins Connector Solutions EMC13DRTN ,we also offer SM3ZS067U215AER1500, 1759547-1, 1-2199230-6, Our vast inventory has you covered. Contact us now for immediate solutions.



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