DSPIC33EP64MC506-E/MR

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Mfr.Part #
DSPIC33EP64MC506-E/MR
Manufacturer
Microchip Technology
Package / Case
64-VFQFN Exposed Pad
Datasheet
Download
Description
IC MCU 16BIT 64KB FLASH 64VQFN
Stock
49,265
In Stock :
49,265

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Manufacturer :
Microchip Technology
Product Category :
Microcontrollers
Minimum Operating Temperature :
- 40 C
Power Supplies :
3.3 V
Terminal Form :
NO LEAD
Base Product Number :
DSPIC33EP64MC506
Temperature Grade :
Automotive
ECCN Code :
3A001.A.3
Peripherals :
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
EEPROM Size :
--
Supply Voltage-Max (Vsup) :
3.6V
Interface :
CAN, I2C, IrDA, LIN, SPI, UART, USART
Maximum Operating Temperature :
+ 125 C
Number of Cores :
1 Core
Lifecycle Status :
Production (Last Updated: 2 years ago)
Has ADC :
yes
Terminal Pitch :
0.5 mm
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Package / Case :
64-VFQFN Exposed Pad
Package :
Tube
RoHS :
Compliant
Terminal Finish :
Matte Tin (Sn) - annealed
Number of I/O Lines :
53
Qualification Status :
Not Qualified
Pin Count :
64
Number of Terminations :
64
Data Converters :
A/D 16x10b/12b
Operating Temperature :
-40°C~125°C TA
Peak Reflow Temperature (Cel) :
260
Length :
9mm
Supply Voltage :
3.3V
Mounting Style :
SMD/SMT
Series :
Automotive, AEC-Q100, dsPIC™ 33EP
Supply Current-Max :
150 mA
Program Memory Type :
Flash
JESD-30 Code :
S-PQCC-N64
Terminal Position :
QUAD
DAC Channels :
No
Interface Type :
I2C, SPI, UART
Connectivity :
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
HTS Code :
8542.31.00.01
Voltage - Supply (Vcc/Vdd) :
3V~3.6V
Product Category :
Digital Signal Processors and Controllers - DSP, DSC
Format :
FLOATING-POINT
Surface Mount :
yes
JESD-609 Code :
e3
Mounting Type :
Surface Mount
Tradename :
dsPIC
ROM Programmability :
Flash
Number of I/Os :
53 I/O
Program Memory Size :
64KB 22K x 24
Mount :
Surface Mount
Width :
9 mm
Min Operating Temperature :
-40 °C
Brand :
Microchip Technology
Time@Peak Reflow Temperature-Max (s) :
40
RoHS Status :
ROHS3 Compliant
RAM (words) :
4096
On Chip Program ROM Width :
24
ROM (words) :
21845
Qualification :
AEC-Q100
Base Part Number :
DSPIC33EP64MC506
Seated Height-Max :
1 mm
Max Frequency :
60 MHz
DMA Channels :
yes
Factory Lead Time :
21 Weeks
Core Size :
16-Bit
Product Status :
Active
Number of Pins :
64
PWM Channels :
yes
Product :
DSCs
Data Converter :
A/D 16x10b/12b
Min Supply Voltage :
2.95 V
Number of I/O :
53
Memory Size :
64KB
RAM Size :
4K x 16
Manufacturer :
Microchip
RAM (bytes) :
8192
Supplier Device Package :
64-QFN (9x9)
Watchdog Timer :
yes
Package Shape :
Square
Core Architecture :
dsPIC
Packaging :
Tube
Data Bus Width :
16b
Number of Terminals :
64
Number of Programmable I/O :
53
Frequency :
60MHz
Max Operating Temperature :
125 °C
Product Type :
DSP - Digital Signal Processors and Controllers
Reach Compliance Code :
Compliant
Speed :
60 MIPs
Interfaces :
CAN/I2C/SPI/UART
Radiation Hardening :
No
Number of Timers/Counters :
5
Memory Type :
Flash
Height Seated (Max) :
1mm
Operating Supply Voltage :
3.3V
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER
Core Processor :
dsPIC
Oscillator Type :
Internal
Bit Size :
16
Max Supply Voltage :
3.6 V
Published :
2012
Introducing Microcontrollers Microchip Technology DSPIC33EP64MC506-E/MR from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:64-VFQFN Exposed Pad, Number of Terminations:64, Operating Temperature:-40°C~125°C TA, Mounting Type:Surface Mount, Base Part Number:DSPIC33EP64MC506, Number of Pins:64, DSPIC33EP64MC506-E/MR pinout, DSPIC33EP64MC506-E/MR datasheet PDF, DSPIC33EP64MC506-E/MR amp .Beyond Microcontrollers Microchip Technology DSPIC33EP64MC506-E/MR ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology DSPIC33EP64MC506-E/MR


Microcontrollers Microchip Technology DSPIC33EP64MC506-E/MR Overview

The Microcontrollers Microchip Technology DSPIC33EP64MC506-E/MR is a high-performance, 16-bit microcontroller that combines efficient processing with advanced features designed to meet the rigorous demands of modern embedded systems. Developed by Microchip Technology, this microcontroller utilizes DSP and MCU capabilities, making it ideal for applications that require complex algorithms and real-time processing. With 64KB of flash memory and versatile peripherals, this microcontroller is a powerful solution for designers looking to enhance system functionality while maintaining cost and power efficiency.

DSPIC33EP64MC506-E/MR Features

This microcontroller is equipped with multiple features that enhance its functionality in complex embedded systems:

  • 16-bit digital signal processing core for high-speed computation.
  • 64KB of flash memory, providing ample space for application code and data storage.
  • Dual partition flash with live update capability, allowing firmware upgrades with zero downtime.
  • Advanced analog features, including ADCs, DACs, and comparators, suitable for precision sensing applications.
  • Multiple communication interfaces such as I2C, SPI, UART, and CAN for flexible connectivity options.
  • Extended temperature range, ensuring reliable operation under extreme conditions.

DSPIC33EP64MC506-E/MR Applications

  • Industrial Automation: Utilized in controlling machinery and processes in factories, where its robust operational capabilities enable precise control and communication in industrial environments.
  • Automotive Systems: Employed in automotive applications for engine management and safety features, leveraging its processing power and real-time capabilities to ensure optimal vehicle performance and reliability.
  • Consumer Electronics: Integrated into devices like smart home systems and multimedia appliances, where its ability to handle complex algorithms improves functionality and user experience.
  • Medical Devices: Applied in medical diagnostic equipment and monitoring systems, using its precision analog capabilities and reliable performance in critical healthcare devices.
  • Communication Systems: Essential for telecommunications infrastructure, where its high-speed interfaces and processing power facilitate efficient data handling and connectivity.
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