DSPIC30F6014-30I/PF

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Mfr.Part #
DSPIC30F6014-30I/PF
Manufacturer
Microchip Technology
Package / Case
80-TQFP
Datasheet
Download
Description
IC MCU 16BIT 144KB FLASH 80TQFP
Stock
70
In Stock :
70

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Manufacturer :
Microchip Technology
Product Category :
Microcontrollers
Data Bus Width :
16b
Series :
dsPIC™ 30F
Frequency :
30MHz
Terminal Form :
Gull wing
Product Type :
DSP - Digital Signal Processors and Controllers
Peak Reflow Temperature (Cel) :
260
Manufacturer :
Microchip
Package Type :
TQFP
ECCN Code :
3A991.A.2
Supplier Device Package :
80-TQFP (14x14)
Pin Count :
80
JESD-30 Code :
S-PQFP-G80
Lead Pitch :
650μm
DMA Channels :
No
Format :
FIXED-POINT
Density :
1.1 Mb
On Chip Program ROM Width :
24
Number of Pins :
80
RAM (words) :
4096
Number of Timers/Counters :
5
Min Supply Voltage :
2.5 V
Min Operating Temperature :
-40 °C
Number of I/O Lines :
68
Power Supplies :
3/5 V
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER, RISC
Core Architecture :
dsPIC
Number of Terminations :
80
Schedule B :
8542310000, 8542310000/8542310000/8542310000/8542310000/8542310000
Terminal Finish :
Matte Tin (Sn) - annealed
Number of Ethernet Channels :
0
Tradename :
dsPIC
Package :
Tray
Base Product Number :
DSPIC30F6014
Row Spacing :
16 mm
REACH SVHC :
No SVHC
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Operating Temperature :
-40°C~85°C TA
Pbfree Code :
yes
Lead Free :
Lead Free
Additional Feature :
ALSO OPERATES AT 2.5V MINIMUM SUPPLY AT 7.5 MHZ
Reach Compliance Code :
Compliant
DAC Channels :
No
Number of Cores :
1 Core
Has ADC :
yes
Voltage - Supply (Vcc/Vdd) :
2.5V~5.5V
Surface Mount :
yes
Mounting Style :
SMD/SMT
Core Processor :
dsPIC
Terminal Position :
QUAD
Time@Peak Reflow Temperature-Max (s) :
40
Number of ADC Channels :
16
Minimum Operating Temperature :
-40 °C
RAM Size :
8K x 8
Number of I/O :
68
Typical Operating Supply Voltage :
2.5 to 5.5 V
Dimensions :
14 x 14 x 1.05mm
Maximum Operating Temperature :
+85 °C
Max Supply Voltage :
5.5 V
Qualification Status :
Not Qualified
Length :
14mm
Radiation Hardening :
No
Seated Height-Max :
1.2 mm
Number of I2C Channels :
1
Lifecycle Status :
NRND (Last Updated: 2 years ago)
Package Shape :
Square
Packaging :
Tray
Number of Programmable I/O :
68
Width :
14mm
Program Memory Type :
Flash
Memory Type :
Flash
Temperature Grade :
Industrial
Product :
DSCs
Core Size :
16-Bit
Supply Voltage :
5V
Memory Size :
144kB
Terminal Pitch :
0.65 mm
Height :
1.05mm
Number of SPI Channels :
2
Factory Lead Time :
14 Weeks
Max Operating Temperature :
85 °C
ROM (words) :
49152
Watchdog Timer :
yes
JESD-609 Code :
e3
PWM Channels :
yes
ROM Programmability :
Flash
Peripherals :
AC'97, Brown-out Detect/Reset, I2S, LVD, POR, PWM, WDT
Oscillator Type :
Internal
Data Converters :
A/D 16x12b
Instruction Set Architecture :
RISC
Number of I/Os :
68 I/O
Operating Supply Voltage :
2.5 V to 5.5 V
Program Memory Size :
144KB 48K x 24
Base Part Number :
DSPIC30F6014
HTS Code :
8542.31.00.01
Package / Case :
80-TQFP
Brand :
Microchip Technology
Number of Terminals :
80
Interface :
CAN, I2C, SPI, UART, USART
Speed :
30 MIPs
RoHS Status :
ROHS3 Compliant
Mounting Type :
Surface Mount
Interface Type :
CAN/I2C/SPI/UART
Number of UART Channels :
2
EEPROM Size :
4K x 8
Max Frequency :
30 MHz
RAM (bytes) :
8192
Product Status :
Active
RoHS :
Details
Product Category :
Digital Signal Processors and Controllers - DSP, DSC
Interfaces :
CAN/I2C/SPI/UART
Data Converter :
A/D 16x12b
Bit Size :
16
Published :
2004
Number of Timers :
5
Introducing Microcontrollers Microchip Technology DSPIC30F6014-30I/PF from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:80, Number of Terminations:80, Operating Temperature:-40°C~85°C TA, Base Part Number:DSPIC30F6014, Package / Case:80-TQFP, Mounting Type:Surface Mount, DSPIC30F6014-30I/PF pinout, DSPIC30F6014-30I/PF datasheet PDF, DSPIC30F6014-30I/PF amp .Beyond Microcontrollers Microchip Technology DSPIC30F6014-30I/PF ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology DSPIC30F6014-30I/PF


Microcontrollers Microchip Technology DSPIC30F6014-30I/PF Overview

Introducing the DSPIC30F6014-30I/PF, a high-performance microcontroller designed by Microchip Technology, tailored for advanced control applications. This microcontroller unit (MCU) from the renowned dsPIC® series excels in delivering robust processing capabilities coupled with significant memory resources, making it ideal for demanding embedded systems. The DSPIC30F6014-30I/PF is engineered to support complex algorithms and multitasking environments, enabling developers to harness its potential in a variety of industrial and commercial applications. Its integration of 144KB flash memory and a versatile set of peripherals enhances system reliability and performance, promoting efficient design cycles and faster time-to-market for products using this Microcontrollers category component from Microchip Technology.

DSPIC30F6014-30I/PF Features

The DSPIC30F6014-30I/PF MCU boasts an array of features designed for versatility and performance in high-demand environments. Key features include a 16-bit processing core, 144KB of flash memory, and an operational speed of up to 30 MIPS. Its 80-pin TQFP (Thin Quad Flat Package) ensures a compact footprint while offering ample I/O options for peripheral integration. Advanced interrupt capabilities and a wide range of communication interfaces, including CAN, SPI, and UART, further enhance its functionality, making it a top choice for developers looking to push the boundaries of what's possible with embedded systems.

DSPIC30F6014-30I/PF Applications

  • Automotive Applications: Utilized in engine management systems and advanced driver-assistance systems (ADAS) where its processing power and memory capacity can handle multiple inputs and outputs while performing real-time analysis and control.
  • Industrial Automation: Perfect for robotics and control systems in manufacturing lines, leveraging its robust I/O capabilities and fast computing to enhance precision and efficiency.
  • Telecommunications: Supports telecommunications equipment with its high-speed interfaces and ability to manage multiple data streams, improving communication protocols and network reliability.
  • Consumer Electronics: Applied in smart home devices and entertainment systems, where it provides ample processing power to support user interfaces, connectivity, and multimedia processing.
  • Medical Devices: Ideal for medical instrumentation such as monitoring systems and automated treatment devices due to its reliability, precise control, and extended operational temperatures.
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