DSPIC30F3013-30I/SP
- Mfr.Part #
- DSPIC30F3013-30I/SP
- Manufacturer
- Microchip Technology
- Package / Case
- 28-DIP (0.300, 7.62mm)
- Datasheet
- Download
- Description
- IC MCU 16BIT 24KB FLASH 28SPDIP
- Stock
- 113
- In Stock :
- 113
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- Manufacturer :
- Microchip Technology
- Product Category :
- Microcontrollers
- Package :
- Tube
- Reach Compliance Code :
- Compliant
- Terminal Position :
- Dual
- Product :
- DSCs
- RAM (words) :
- 2048
- Interfaces :
- I2C/SPI/UART
- Length :
- 35.56mm
- DAC Channels :
- No
- Interface :
- I2C, SPI, UART, USART
- Number of Timers/Counters :
- 3
- Device Core :
- dsPIC
- Oscillator Type :
- Internal
- ROM Programmability :
- Flash
- Pin Count :
- 28
- Terminal Finish :
- Matte Tin (Sn)
- Number of A/D Converters :
- 1
- HTS Code :
- 8542.31.00.01
- Mount :
- Through Hole
- Core Processor :
- dsPIC
- Temperature Grade :
- Industrial
- Terminal Pitch :
- 2.54 mm
- Watchdog Timer :
- yes
- Power Supplies :
- 3/5 V
- Bit Size :
- 16
- uPs/uCs/Peripheral ICs Type :
- MICROCONTROLLER, RISC
- Data Bus Width :
- 16b
- Operating Supply Voltage (Min) :
- 2.5(V)
- ECCN Code :
- 3A991.A.2
- Number of I/O :
- 20
- Mounting Type :
- Through Hole
- Memory Size :
- 24KB
- Published :
- 2006
- JESD-609 Code :
- e3
- Frequency :
- 30MHz
- Instruction Set Architecture :
- RISC
- REACH SVHC :
- No SVHC
- Has ADC :
- yes
- Number of Timers - General Purpose :
- 3
- Operating Supply Voltage (Max) :
- 5.5(V)
- Manufacturer :
- Microchip
- Number of Timers :
- 3
- Program Memory Type :
- Flash
- Operating Temp Range :
- -40C to 85C
- ROM (words) :
- 8192
- Core Size :
- 16-Bit
- Height :
- 3.81mm
- Operating Temperature :
- -40°C~85°C TA
- EEPROM Size :
- 1K x 8
- Voltage - Supply (Vcc/Vdd) :
- 2.5V~5.5V
- Clock Freq :
- 30(MHz)
- Number of Programmable I/O :
- 30
- RoHS Status :
- ROHS3 Compliant
- Width :
- 7.493mm
- Maximum Operating Temperature :
- +85 °C
- Dimensions :
- 1.4 x 0.295 x 0.15in
- Number of I/O Lines :
- 20
- Supply Voltage :
- 5V
- Operating Temperature (Min) :
- -40C
- RAM (bytes) :
- 2048
- Packaging :
- Tube
- Product Category :
- Digital Signal Processors and Controllers - DSP, DSC
- Tradename :
- dsPIC
- RAM Size :
- 2K x 8
- Package Shape :
- RECTANGULAR
- Series :
- dsPIC™ 30F
- JESD-30 Code :
- R-PDIP-T28
- Pbfree Code :
- yes
- Number of I/Os :
- 30 I/O
- Family Name :
- dsPIC30F
- Interface Type :
- I2C/SPI/UART
- Mounting :
- Through Hole
- Operating Temperature Classification :
- Industrial
- Format :
- FIXED-POINT
- Number of I2C Channels :
- 1
- Number of Bits :
- 16
- Product Status :
- Active
- Operating Temperature (Max) :
- 85C
- Minimum Operating Temperature :
- -40 °C
- Number of Ethernet Channels :
- 0
- RoHS :
- Details
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Connectivity :
- I2C, SPI, UART/USART
- Number of ADC Channels :
- 10
- Product Type :
- DSP - Digital Signal Processors and Controllers
- Peripherals :
- Brown-out Detect/Reset, POR, PWM, WDT
- Lead Free :
- Lead Free
- Number of Pins :
- 28
- Base Part Number :
- DSPIC30F3013
- Package Type :
- SPDIP
- Number of PWM Channels :
- 2
- Mounting Style :
- Through Hole
- Qualification Status :
- Not Qualified
- Speed :
- 30 MIPs
- PWM Channels :
- yes
- Radiation Hardening :
- No
- Seated Height-Max :
- 4.06 mm
- Terminal Form :
- THROUGH-HOLE
- Total Internal Ram Size :
- 2KB(kB)
- Device Million Instructions per Second :
- 30MIPS
- Operating Supply Voltage :
- 5V
- Surface Mount :
- No
- Program Memory Size :
- 24KB 8K x 24
- Base Product Number :
- DSPIC30F3013
- Number of SPI Channels :
- 1
- Peak Reflow Temperature (Cel) :
- Not Applicable
- Data Converters :
- A/D 10x12b
- Density :
- 192 kB
- Factory Lead Time :
- 6 Weeks
- Additional Feature :
- ALSO OPERATES AT 2.5V MINIMUM SUPPLY AT 10MHZ
- Number of Terminals :
- 28
- Device Core Size :
- 16(b)
- Programmable :
- yes
- Data Converter :
- A/D 10x12b
- DMA Channels :
- No
- Brand :
- Microchip Technology / Atmel
- Supplier Device Package :
- 28-SPDIP
- Number of Terminations :
- 28
- Typical Operating Supply Voltage :
- 2.5 → 5.5 V
- Number of UART Channels :
- 2
- Package / Case :
- 28-DIP (0.300, 7.62mm)
- # I/Os (Max) :
- 20
- Rad Hardened :
- No
- Operating Supply Voltage (Typ) :
- 3.3/5(V)
- Number of Cores :
- 1 Core
- On Chip Program ROM Width :
- 24
- Datasheets
- DSPIC30F3013-30I/SP

Microcontrollers Microchip Technology DSPIC30F3013-30I/SP Overview
The DSPIC30F3013-30I/SP by Microchip Technology is a high-performance, 16-bit microcontroller designed for advanced applications requiring a blend of control and power efficiency. Embedded with 24KB of flash memory and housed in a 28SPDIP package, this microcontroller is ideal for developers looking for robust performance in industrial-grade applications. It supports a wide voltage range and offers various power-saving modes, making it a versatile choice for energy-conscious projects with stringent space constraints. The Microcontrollers Microchip Technology DSPIC30F3013-30I/SP is tailored to deliver exceptional processing capabilities while maintaining low power consumption and high reliability.
DSPIC30F3013-30I/SP Features
This microcontroller unit (MCU) boasts an array of features that enhance its utility and efficiency in complex electronic systems. Key features include a high-speed 30 MIPS (Million Instructions Per Second) performance, an internal oscillator for reliable timing, extensive peripheral set for enhanced system integration, and an ADC with up to 16 channels, supporting sophisticated sensor systems. Additionally, its enhanced Flash memory technology ensures durable and reliable storage for critical applications.
DSPIC30F3013-30I/SP Applications
- Automotive Systems: Utilized in engine management and advanced driver-assistance systems (ADAS) to handle real-time processing and control tasks efficiently.
- Industrial Automation: Plays a critical role in managing automation controllers and real-time system monitoring, ensuring operational precision and reliability.
- Consumer Electronics: Serves as a control hub in devices like home automation systems and smart appliances, providing both functionality and interconnectivity.
- Medical Devices: Key component in portable medical diagnostics and monitoring equipment, facilitating compact, power-efficient designs.
- Telecommunication: Supports communication protocols in devices requiring high-speed data processing and reliable operation under various conditions.
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