DSP56F827FG80E

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Published :

1998

RAM Size :

4K x 16

Width :

14mm

Connectivity :

EBI/EMI, SCI, SPI, SSI

JESD-609 Code :

e3

Barrel Shifter :

yes

Terminal Pitch :

0.5mm

Terminal Position :

QUAD

Number of I/O :

64

Core Size :

16-Bit

Program Memory Type :

Flash

External Data Bus Width :

16

ECCN Code :

3A991.A.2

Speed :

80MHz

Surface Mount :

yes

Supply Voltage-Min (Vsup) :

2.5V

Program Memory Size :

128KB 64K x 16

Qualification Status :

Not Qualified

Package / Case :

128-LQFP

Data Converter :

A/D 10x12b

Boundary Scan :

yes

Packaging :

Tray

Additional Feature :

ALSO REQUIRES 3.3V SUPPLY

Length :

20mm

Operating Temperature :

-40°C~85°C TA

Base Part Number :

DSP56F827

Voltage - Supply (Vcc/Vdd) :

2.25V~2.75V

RoHS Status :

ROHS3 Compliant

Format :

FIXED POINT

Supply Voltage :

2.5V

Low Power Mode :

yes

Mounting Type :

Surface Mount

Internal Bus Architecture :

Multiple

Oscillator Type :

External

uPs/uCs/Peripheral ICs Type :

DIGITAL SIGNAL PROCESSOR, OTHER

Supply Voltage-Max (Vsup) :

2.75V

JESD-30 Code :

R-PQFP-G128

Time@Peak Reflow Temperature-Max (s) :

40

Factory Lead Time :

10 Weeks

Terminal Form :

Gull wing

Address Bus Width :

16

Core Processor :

56800

Peripherals :

POR, PWM, WDT

Height Seated (Max) :

1.6mm

Series :

56F8xx

Terminal Finish :

Matte Tin (Sn)

Number of Terminations :

128

Peak Reflow Temperature (Cel) :

260

Clock Frequency :

80MHz

HTS Code :

8542.31.00.01

Moisture Sensitivity Level (MSL) :

3 (168 Hours)