DS34S132GN+

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Mfr.Part #
DS34S132GN+
Manufacturer
Analog Devices, Inc.
Package / Case
BGA
Datasheet
Download
Description
IC TDM OVER PACKET 676-BGA
Stock
43
In Stock :
43

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Manufacturer :
Analog Devices, Inc.
Product Category :
Telecom
Number of Terminations :
676
Number of Circuits :
1
ECCN Code :
EAR99
Number of Functions :
1
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Peak Reflow Temperature (Cel) :
260
Package / Case :
BGA
Width :
27mm
Published :
2012
Packaging :
Tray
Mount :
Surface Mount
Telecom IC Type :
Framer
Number of Pins :
676
Min Operating Temperature :
-40°C
Pbfree Code :
yes
Time@Peak Reflow Temperature-Max (s) :
30
Radiation Hardening :
No
Max Operating Temperature :
85°C
Terminal Form :
Ball
RoHS Status :
ROHS3 Compliant
Pin Count :
676
Supply Voltage :
1.8V
Terminal Position :
BOTTOM
Factory Lead Time :
16 Weeks
Length :
27mm
Data Rate :
2.048 Mbps
Temperature Grade :
Industrial
Datasheets
DS34S132GN+
Introducing Telecom Analog Devices, Inc. DS34S132GN+ from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:676, Package / Case:BGA, Number of Pins:676, DS34S132GN+ pinout, DS34S132GN+ datasheet PDF, DS34S132GN+ amp .Beyond Telecom Analog Devices, Inc. DS34S132GN+ ,we also offer CPC5712UTR, MT8870DS1, SI32176-C-FM1R, Our vast inventory has you covered. Contact us now for immediate solutions.

Analog Devices, Inc. DS34S132GN+


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