DS3251NA3

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Mfr.Part #
DS3251NA3
Manufacturer
Analog Devices, Inc.
Package / Case
144-BGA, CSPBGA
Datasheet
Download
Description
IC TELECOM INTERFACE 144CSBGA
Stock
7,666
In Stock :
7,666

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Manufacturer :
Analog Devices, Inc.
Product Category :
Telecom
Published :
2006
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Voltage - Supply :
3.135V~3.465V
Number of Circuits :
1
Operating Temperature :
-40°C~85°C
Current - Supply :
80mA
Mounting Type :
Surface Mount
Function :
Line Interface Unit (LIU)
RoHS Status :
Non-RoHS Compliant
Packaging :
Tray
Package / Case :
144-BGA, CSPBGA
Interface :
LIU
Base Part Number :
DS3251
Datasheets
DS3251NA3
Introducing Telecom Analog Devices, Inc. DS3251NA3 from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~85°C, Mounting Type:Surface Mount, Package / Case:144-BGA, CSPBGA, Base Part Number:DS3251, DS3251NA3 pinout, DS3251NA3 datasheet PDF, DS3251NA3 amp .Beyond Telecom Analog Devices, Inc. DS3251NA3 ,we also offer CPC5712UTR, MT8870DS1, SI32176-C-FM1R, Our vast inventory has you covered. Contact us now for immediate solutions.

Analog Devices, Inc. DS3251NA3


Telecom Analog Devices, Inc. DS3251NA3 Overview

The DS3251NA3 from Analog Devices, Inc. stands out in the market of telecommunications interface circuits, specifically designed for sophisticated network applications. This Integrated Circuit (IC) is housed in a 144CSBGA package, making it ideally suited for high-performance telecom systems requiring compact and reliable components. The Telecom Analog Devices, Inc. DS3251NA3 is engineered to meet the rigorous demands of modern telecommunications infrastructure, offering unparalleled reliability and integration flexibility. Its robust design ensures optimal functionality in a wide range of environmental conditions, making it a preferred choice for developers and engineers focused on telecommunications advancements.

DS3251NA3 Features

The DS3251NA3 IC is tailored to enhance telecommunications interfaces with several key features:

  • High-density Ball Grid Array (BGA) packaging for reduced space and enhanced performance.
  • Exceptional signal integrity, minimizing latency and improving data transmission efficiency.
  • Robust design suited for harsh telecommunications environments.
  • Easy integration into existing and new telecom infrastructure.

DS3251NA3 Applications

  • Network Routers: Utilized in router designs to manage data traffic efficiently and enhance connectivity across networks.
  • Telecom Switching Systems: Critical for the operations of switching systems that require reliable and continuous operation in telecommunications networks.
  • High-Speed Internet Servers: Supports high-speed internet services by ensuring stable and fast data transmission capabilities.
  • Wireless Communication Equipment: Employed in the design of wireless gear to facilitate improved signal processing and data flow in mobile networks.
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