DS3174N
- Mfr.Part #
- DS3174N
- Manufacturer
- Analog Devices, Inc.
- Package / Case
- 349-BBGA, CSBGA Exposed Pad
- Datasheet
- Download
- Description
- IC TELECOM INTERFACE 400BGA
- Stock
- 4,043
- In Stock :
- 4,043
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- Manufacturer :
- Analog Devices, Inc.
- Product Category :
- Telecom
- Supply Voltage :
- 3.3V
- RoHS Status :
- ROHS3 Compliant
- Moisture Sensitivity Level (MSL) :
- 5 (48 Hours)
- Interface :
- DS3, E3
- Mounting Type :
- Surface Mount
- Surface Mount :
- yes
- Package / Case :
- 349-BBGA, CSBGA Exposed Pad
- Published :
- 2006
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Function :
- Single-Chip Transceiver
- Length :
- 27mm
- Telecom IC Type :
- Framer
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Terminal Pitch :
- 1.27mm
- Current - Supply :
- 725mA
- Operating Temperature :
- -40°C~85°C
- Pbfree Code :
- yes
- Terminal Form :
- Ball
- Power Supplies :
- 3.3V
- Qualification Status :
- Not Qualified
- Base Part Number :
- DS3174
- Width :
- 27mm
- ECCN Code :
- EAR99
- Number of Circuits :
- 4
- Number of Terminations :
- 400
- Voltage - Supply :
- 3.135V~3.465V
- Terminal Position :
- BOTTOM
- Packaging :
- Tray
- JESD-609 Code :
- e1
- Peak Reflow Temperature (Cel) :
- 260
- Datasheets
- DS3174N

Telecom Analog Devices, Inc. DS3174N Overview
The DS3174N from Analog Devices, Inc. is a sophisticated IC telecom interface, specifically designed for high-performance telecommunications infrastructure. This integrated circuit encapsulates state-of-the-art technology in a compact 400-BGA package, ensuring reliable operation and superior functionality in dense telecom configurations. As a vital component in advanced telecom systems, the DS3174N facilitates robust data and signal management capabilities that are essential for high-speed networking and communications solutions. The use of the Telecom Analog Devices, Inc. DS3174N ensures seamless integration and operational excellence in challenging and dynamic telecom environments.
DS3174N Features
The DS3174N IC telecom interface is packed with features designed for high-demand telecom applications. Key features include advanced signal processing capabilities, high-speed data throughput, and low-latency performance. The 400-BGA packaging allows for efficient space utilization and better heat dissipation, which is crucial for maintaining reliability and performance in tightly packed telecom racks. Additionally, the DS3174N supports various communication protocols, making it versatile and adaptable to a range of telecom networking technologies.
DS3174N Applications
- Network Routers and Switches: The DS3174N is used to enhance signal integrity and processing speed, crucial for managing data traffic efficiently in network routers and switches.
- Telecom Switching Systems: This IC enables reliable, high-speed switching capabilities essential for modern telecom infrastructure, ensuring minimal signal loss and maximal throughput.
- Wireless Base Stations: In wireless communications, the DS3174N helps in managing multiple data streams simultaneously, optimizing both uplink and downlink communications.
- Broadband Access Equipment: The DS3174N supports broadband technologies, improving the performance and reliability of equipment used in high-speed internet services.
- VOIP Systems: Ideal for Voice over Internet Protocol (VOIP) systems, the DS3174N ensures clear and uninterrupted voice transmission over internet-based networks.
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