DS3174

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Mfr.Part #
DS3174
Manufacturer
Analog Devices, Inc.
Package / Case
349-BBGA, CSBGA Exposed Pad
Datasheet
Download
Description
IC TELECOM INTERFACE 400BGA
Stock
42,548
In Stock :
42,548

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Manufacturer :
Analog Devices, Inc.
Product Category :
Telecom
Number of Circuits :
4
Radiation Hardening :
No
RoHS Status :
ROHS3 Compliant
Supply Voltage :
3.3V
JESD-609 Code :
e0
Voltage - Supply :
3.135V~3.465V
Packaging :
Tray
Terminal Position :
BOTTOM
Mounting Type :
Surface Mount
Terminal Finish :
Tin/Lead (Sn/Pb)
Length :
27mm
Mount :
Surface Mount
Power Supplies :
3.3V
Logic Function :
Transceiver
Terminal Form :
Ball
Telecom IC Type :
Framer
Moisture Sensitivity Level (MSL) :
5 (48 Hours)
Package / Case :
349-BBGA, CSBGA Exposed Pad
Interface :
DS3, E3
ECCN Code :
EAR99
Peak Reflow Temperature (Cel) :
240
Terminal Pitch :
1.27mm
Published :
2006
Function :
Single-Chip Transceiver
Operating Supply Current :
725mA
Base Part Number :
DS3174
Number of Terminations :
400
Width :
27mm
Operating Temperature :
0°C~70°C
Number of Pins :
400
Pbfree Code :
No
Datasheets
DS3174
Introducing Telecom Analog Devices, Inc. DS3174 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:349-BBGA, CSBGA Exposed Pad, Base Part Number:DS3174, Number of Terminations:400, Operating Temperature:0°C~70°C, Number of Pins:400, DS3174 pinout, DS3174 datasheet PDF, DS3174 amp .Beyond Telecom Analog Devices, Inc. DS3174 ,we also offer CPC5712UTR, MT8870DS1, SI32176-C-FM1R, Our vast inventory has you covered. Contact us now for immediate solutions.

Analog Devices, Inc. DS3174


Telecom Analog Devices, Inc. DS3174 Overview

The DS3174 from Analog Devices, Inc. is a high-performance IC telecom interface, expertly crafted to address the demanding needs of modern telecommunication infrastructures. Designed for seamless integration within 400BGA packaging, this interface chip is essential for developers looking to implement robust, high-speed communication solutions. The DS3174 excels in providing reliable connectivity and is engineered to support a wide range of telecom applications, making it a pivotal component for bulk purchasing among B2B clients looking to enhance system reliability and performance.

DS3174 Features

The DS3174 features a comprehensive suite of capabilities designed to enhance telecom system designs. Key features include advanced signal processing, high-speed data transfer rates, and compatibility with multiple telecom standards. Its robust design ensures optimal performance in diverse operating environments, thus providing a reliable foundation for developing complex communication systems.

DS3174 Applications

  • Data Centers: In data centers, the DS3174 is utilized to facilitate high-speed data communications between servers and storage systems, enhancing overall data throughput and reliability.
  • Telecommunications Equipment: This IC is integral in various telecommunication systems, including switches and routers, where it ensures efficient signal processing and bandwidth management for improved network performance.
  • Wireless Infrastructure: The DS3174 supports wireless communications infrastructure by providing robust interfaces for signal conversion and transmission, crucial for maintaining high standards of connectivity in mobile networks.
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