DS3164
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- Mfr.Part #
- DS3164
- Manufacturer
- Analog Devices, Inc.
- Package / Case
- 400-BBGA
- Datasheet
- Download
- Description
- IC PHY TRANSCEIVER 400PBGA
- Stock
- 22,159
- In Stock ：
- 22,159
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- Manufacturer :
- Analog Devices, Inc.
- Product Category :
- Specialized ICs
- Number of Pins :
- 400
- Moisture Sensitivity Level (MSL) :
- 5 (48 Hours)
- Peak Reflow Temperature (Cel) :
- 240
- Applications :
- Testing Equipment
- Published :
- 2006
- Number of Terminations :
- 400
- Operating Temperature (Max) :
- 70°C
- Width :
- 27mm
- Radiation Hardening :
- No
- Length :
- 27mm
- ECCN Code :
- EAR99
- Mount :
- Surface Mount
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Package / Case :
- 400-BBGA
- JESD-609 Code :
- e0
- Terminal Pitch :
- 1.27mm
- Pin Count :
- 400
- Pbfree Code :
- No
- Base Part Number :
- DS3164
- Terminal Position :
- BOTTOM
- Power Supplies :
- 3.3V
- Type :
- PHY Transceiver
- Terminal Form :
- Ball
- Data Rate :
- 52 Mbps
- HTS Code :
- 8542.39.00.01
- Supply Current-Max :
- 0.468mA
- Temperature Grade :
- COMMERCIAL
- Number of Functions :
- 1
- RoHS Status :
- ROHS3 Compliant
- Mounting Type :
- Surface Mount
- Packaging :
- Tray
- Height Seated (Max) :
- 2.54mm
- Supply Voltage :
- 3.3V
- Datasheets
- DS3164
[Specialized ICs Analog Devices, Inc. DS3164] Overview
Introducing the DS3164, a cutting-edge Integrated Circuit (IC) PHY Transceiver meticulously crafted by Analog Devices, Inc. Designed to meet the demands of modern communication systems, this advanced transceiver comes in a 400-pin Ball Grid Array (BGA) package, ensuring optimal performance and reliability in diverse applications.
Engineered with precision and innovation, the DS3164 embodies the pinnacle of semiconductor technology, providing seamless connectivity solutions for high-speed data transmission. Its robust design and versatile capabilities make it an indispensable component for telecommunications, networking, and industrial automation applications.
DS3164 Features
- Highly Integrated Design: The DS3164 integrates essential functions required for physical layer communication, minimizing external component count and simplifying system design.
- 400-Pin BGA Package: With a compact form factor and reliable ball grid array packaging, the DS3164 ensures easy integration into various electronic systems while enhancing thermal performance.
- High-Speed Data Transmission: Leveraging advanced signal processing algorithms, the DS3164 enables seamless transmission of data at ultra-fast speeds, ensuring efficient communication in demanding environments.
- Low Power Consumption: Designed for energy efficiency, the DS3164 optimizes power consumption without compromising performance, making it ideal for battery-operated devices and power-sensitive applications.
- Robust Signal Integrity: Equipped with advanced signal conditioning features, the DS3164 ensures robust signal integrity and noise immunity, delivering consistent performance in challenging operating conditions.
DS3164 Applications
- Telecommunications Infrastructure: The DS3164 is widely deployed in telecommunications infrastructure such as base stations, repeaters, and optical network terminals, facilitating high-speed data transmission and reliable communication.
- Network Switches and Routers: Leveraging its high-speed data transmission capabilities, the DS3164 is integrated into network switches and routers, enabling seamless connectivity and efficient data routing in enterprise and data center environments.
- Industrial Automation Systems: In industrial automation applications, the DS3164 serves as a critical component for real-time data exchange between control systems, sensors, and actuators, ensuring efficient operation and monitoring of manufacturing processes.
- Medical Imaging Equipment: The DS3164 is utilized in medical imaging equipment such as MRI machines and CT scanners, facilitating high-speed data transfer between imaging sensors and processing units, enabling accurate diagnosis and treatment.
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