DS2704G+

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Mfr.Part #
DS2704G+
Manufacturer
Analog Devices, Inc.
Package / Case
6-WDFN Exposed Pad
Datasheet
Download
Description
IC EEPROM 1.25K 1-WIRE 6TDFN
Stock
45,048
In Stock :
45,048

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Manufacturer :
Analog Devices, Inc.
Product Category :
Memory
Access Time :
2μs
RoHS Status :
ROHS3 Compliant
JESD-609 Code :
e3
Organization :
128X8
Pin Count :
6
Terminal Finish :
Matte Tin (Sn)
Write Protection :
SOFTWARE
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Number of Terminations :
6
Data Retention Time-Min :
10
Package / Case :
6-WDFN Exposed Pad
HTS Code :
8542.32.00.51
Number of Pins :
6
Power Supplies :
3/5V
Standby Current-Max :
0.000002A
Pbfree Code :
yes
Published :
2007
Supply Voltage-Max (Vsup) :
5.5V
Memory Width :
8
Surface Mount :
yes
Radiation Hardening :
No
Interface :
Serial
Memory Format :
EEPROM
Memory Type :
Non-Volatile
Peak Reflow Temperature (Cel) :
260
Packaging :
Tube
Supply Voltage-Min (Vsup) :
2.5V
Terminal Position :
Dual
Density :
1.3 kb
Time@Peak Reflow Temperature-Max (s) :
30
Supply Current-Max :
0.00075mA
Base Part Number :
DS2704
Memory Interface :
1-Wire®
Endurance :
50000 Write/Erase Cycles
Terminal Pitch :
0.95mm
Memory Size :
1.25Kb 32Bytes x 5 pages
Voltage - Supply :
2.5V~5.5V
Mounting Type :
Surface Mount
Number of Functions :
1
ECCN Code :
EAR99
Operating Temperature :
-30°C~85°C TA
Datasheets
DS2704G+
Introducing Memory Analog Devices, Inc. DS2704G+ from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:6, Package / Case:6-WDFN Exposed Pad, Number of Pins:6, Base Part Number:DS2704, Mounting Type:Surface Mount, Operating Temperature:-30°C~85°C TA, DS2704G+ pinout, DS2704G+ datasheet PDF, DS2704G+ amp .Beyond Memory Analog Devices, Inc. DS2704G+ ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Analog Devices, Inc. DS2704G+


Memory Analog Devices, Inc. DS2704G+ Overview

The DS2704G+ from Analog Devices, Inc. is a high-performance EEPROM IC designed to meet the demanding requirements of today's sophisticated electronic devices. With a compact 6TDFN package, this Memory category product ensures a minimal footprint on PCBs, making it ideal for space-constrained applications. Its 1.25K memory size is optimized for applications that require data storage without the overhead of larger, more complex memory systems. Employing a 1-Wire interface, the DS2704G+ provides a simple and efficient method for data communication, which simplifies the integration process and reduces overall system costs. This EEPROM IC is perfect for manufacturers looking to incorporate reliable data storage solutions with high durability and low power consumption.

DS2704G+ Features

The DS2704G+ EEPROM IC offers several key features that make it a versatile choice for various applications. Its 1.25K-byte storage capacity is ideal for storing configuration data, calibration constants, or device serialization. The 1-Wire protocol supported by the DS2704G+ enables minimal pin usage, which is critical for reducing the complexity and size of device interfaces. Additionally, the 6TDFN package is highly robust, providing enhanced protection against mechanical stress and environmental factors, thereby ensuring reliability and longevity in harsh environments.

DS2704G+ Applications

  • Consumer Electronics: Utilized in devices like smart watches and fitness trackers, where space is limited, and efficient data storage is necessary for user settings and activity logs.
  • Medical Devices: Integrated in portable medical monitors and diagnostic equipment for storing critical calibration data ensuring accuracy and reliability in readings.
  • Industrial Automation: Employed in sensors and automation controllers, where durable and reliable memory is required for operational parameters and system state logs.
  • Telecommunication Equipment: Used in network devices for storing firmware and configuration settings, enabling easy updates and consistent performance across network infrastructures.
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