DS2704G+

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Mfr.Part #
DS2704G+
Manufacturer
Analog Devices, Inc.
Package / Case
6-WDFN Exposed Pad
Datasheet
Download
Description
IC EEPROM 1.25K 1-WIRE 6TDFN
Stock
45,048
In Stock :
45,048

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Manufacturer :
Analog Devices, Inc.
Product Category :
Memory
Mounting Type :
Surface Mount
Organization :
128X8
Memory Format :
EEPROM
Peak Reflow Temperature (Cel) :
260
Surface Mount :
yes
Write Protection :
SOFTWARE
Package / Case :
6-WDFN Exposed Pad
Number of Functions :
1
Number of Terminations :
6
Base Part Number :
DS2704
Radiation Hardening :
No
JESD-609 Code :
e3
Published :
2007
ECCN Code :
EAR99
HTS Code :
8542.32.00.51
Voltage - Supply :
2.5V~5.5V
Operating Temperature :
-30°C~85°C TA
Access Time :
2μs
Supply Current-Max :
0.00075mA
Number of Pins :
6
Power Supplies :
3/5V
Packaging :
Tube
Time@Peak Reflow Temperature-Max (s) :
30
Memory Type :
Non-Volatile
Pin Count :
6
RoHS Status :
ROHS3 Compliant
Endurance :
50000 Write/Erase Cycles
Memory Size :
1.25Kb 32Bytes x 5 pages
Supply Voltage-Min (Vsup) :
2.5V
Terminal Pitch :
0.95mm
Supply Voltage-Max (Vsup) :
5.5V
Interface :
Serial
Standby Current-Max :
0.000002A
Pbfree Code :
yes
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Data Retention Time-Min :
10
Terminal Position :
Dual
Terminal Finish :
Matte Tin (Sn)
Memory Interface :
1-Wire®
Density :
1.3 kb
Memory Width :
8
Datasheets
DS2704G+
Introducing Memory Analog Devices, Inc. DS2704G+ from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:6-WDFN Exposed Pad, Number of Terminations:6, Base Part Number:DS2704, Operating Temperature:-30°C~85°C TA, Number of Pins:6, DS2704G+ pinout, DS2704G+ datasheet PDF, DS2704G+ amp .Beyond Memory Analog Devices, Inc. DS2704G+ ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Analog Devices, Inc. DS2704G+


Memory Analog Devices, Inc. DS2704G+ Overview

The DS2704G+ from Analog Devices, Inc. is a high-performance EEPROM IC designed to meet the demanding requirements of today's sophisticated electronic devices. With a compact 6TDFN package, this Memory category product ensures a minimal footprint on PCBs, making it ideal for space-constrained applications. Its 1.25K memory size is optimized for applications that require data storage without the overhead of larger, more complex memory systems. Employing a 1-Wire interface, the DS2704G+ provides a simple and efficient method for data communication, which simplifies the integration process and reduces overall system costs. This EEPROM IC is perfect for manufacturers looking to incorporate reliable data storage solutions with high durability and low power consumption.

DS2704G+ Features

The DS2704G+ EEPROM IC offers several key features that make it a versatile choice for various applications. Its 1.25K-byte storage capacity is ideal for storing configuration data, calibration constants, or device serialization. The 1-Wire protocol supported by the DS2704G+ enables minimal pin usage, which is critical for reducing the complexity and size of device interfaces. Additionally, the 6TDFN package is highly robust, providing enhanced protection against mechanical stress and environmental factors, thereby ensuring reliability and longevity in harsh environments.

DS2704G+ Applications

  • Consumer Electronics: Utilized in devices like smart watches and fitness trackers, where space is limited, and efficient data storage is necessary for user settings and activity logs.
  • Medical Devices: Integrated in portable medical monitors and diagnostic equipment for storing critical calibration data ensuring accuracy and reliability in readings.
  • Industrial Automation: Employed in sensors and automation controllers, where durable and reliable memory is required for operational parameters and system state logs.
  • Telecommunication Equipment: Used in network devices for storing firmware and configuration settings, enabling easy updates and consistent performance across network infrastructures.
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