DS26324GN

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Mfr.Part #
DS26324GN
Manufacturer
Analog Devices, Inc.
Package / Case
256-LBGA, CSBGA
Datasheet
Download
Description
IC TELECOM INTERFACE 256CSBGA
Stock
7,636
In Stock :
7,636

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Manufacturer :
Analog Devices, Inc.
Product Category :
Telecom
Published :
2007
Width :
17mm
Voltage - Supply :
3.135V~3.465V
Telecom IC Type :
PCM TRANSCEIVER
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s) :
30
Number of Pins :
256
Terminal Form :
Ball
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Number of Circuits :
16
ECCN Code :
EAR99
Height Seated (Max) :
1.76mm
Frequency :
1.544MHz
Base Part Number :
DS26324
Operating Supply Voltage :
3.3V
Terminal Position :
BOTTOM
Number of Terminations :
256
Pbfree Code :
yes
HTS Code :
8542.39.00.01
RoHS Status :
ROHS3 Compliant
Mounting Type :
Surface Mount
Length :
17mm
Operating Temperature :
-40°C~85°C
Qualification Status :
Not Qualified
Lead Free :
Lead Free
Peak Reflow Temperature (Cel) :
260
Package / Case :
256-LBGA, CSBGA
Interface :
LIU
Function :
Line Interface Unit (LIU)
Supply Voltage :
3.3V
JESD-609 Code :
e1
Packaging :
Tray
Factory Lead Time :
6 Weeks
Nominal Supply Current :
500mA
Terminal Pitch :
1mm
Mount :
Surface Mount
Datasheets
DS26324GN
Introducing Telecom Analog Devices, Inc. DS26324GN from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:256, Base Part Number:DS26324, Number of Terminations:256, Mounting Type:Surface Mount, Operating Temperature:-40°C~85°C, Package / Case:256-LBGA, CSBGA, DS26324GN pinout, DS26324GN datasheet PDF, DS26324GN amp .Beyond Telecom Analog Devices, Inc. DS26324GN ,we also offer CPC5712UTR, MT8870DS1, SI32176-C-FM1R, Our vast inventory has you covered. Contact us now for immediate solutions.

Analog Devices, Inc. DS26324GN


Telecom Analog Devices, Inc. DS26324GN Overview

The DS26324GN by Analog Devices, Inc. stands out in the market of telecom interface circuits, designed specifically for high-performance telecommunications systems. This advanced integrated circuit encapsulates robust features in a 256CSBGA package, making it ideal for complex digital network systems. Engineered to facilitate reliable data and voice communications, the DS26324GN excels in integrating multiple telecom protocols and ensures enhanced signal integrity. Its implementation in telecom infrastructures speaks volumes about its efficiency and the technological leverage it offers, making it a strategic component for telecom operators aiming to optimize and expand their network capabilities.

DS26324GN Features

The DS26324GN IC includes multiple standout features such as high-speed operation, compatibility with multiple telecom standards, and low power consumption. Its small form factor is tailored for dense board configurations, promoting a streamlined design without sacrificing performance. Additionally, the BGA package ensures improved thermal management and better electrical performance, which are critical in high-demand telecom applications.

DS26324GN Applications

  • Network Switches and Routers: Employs DS26324GN to manage data flow efficiently between multiple network interfaces, ensuring seamless data and voice transmission across the network.
  • Telecom Infrastructure: Utilizes DS26324GN for its ability to handle high-speed digital signals, facilitating robust backbone communications systems that support extensive data transmission requirements.
  • Wireless Base Stations: The IC is crucial in processing signals for base stations, enhancing the quality and reliability of wireless communications within cellular networks.
  • VoIP Services: Integrates DS26324GN to provide reliable and high-quality voice over internet protocol services, ensuring clear and uninterrupted voice transmissions over the internet.
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