DS250DF810ABVT
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- Mfr.Part #
- DS250DF810ABVT
- Manufacturer
- Texas Instruments
- Package / Case
- 135-BGA Module
- Datasheet
- Download
- Description
- IC INTFACE SPECIALIZED 135FCBGA
- Stock
- 2,109
- In Stock ：
- 2,109
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- Manufacturer :
- Texas Instruments
- Product Category :
- Specialized
- Pbfree Code :
- yes
- Max Operating Temperature :
- 85°C
- Width :
- 8mm
- Number of Terminations :
- 135
- Package / Case :
- 135-BGA Module
- ECCN Code :
- EAR99
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Mounting Type :
- Surface Mount
- Lifecycle Status :
- ACTIVE (Last Updated: 3 days ago)
- Number of Channels :
- 8
- JESD-609 Code :
- e1
- Number of Pins :
- 135
- Temperature Grade :
- Other
- Packaging :
- Tape and Reel (TR)
- Applications :
- Retimer
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Number of Functions :
- 1
- Terminal Form :
- Ball
- Peak Reflow Temperature (Cel) :
- 260
- Factory Lead Time :
- 6 Weeks
- RoHS Status :
- ROHS3 Compliant
- Min Operating Temperature :
- -10°C
- Height :
- 2.51mm
- Interface IC Type :
- INTERFACE CIRCUIT
- Base Part Number :
- DS250DF810
- Terminal Position :
- BOTTOM
- Lead Free :
- Lead Free
- Thickness :
- 580μm
- Mount :
- Surface Mount
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Length :
- 13mm
- Datasheets
- DS250DF810ABVT
Specialized Texas Instruments DS250DF810ABVT Overview
The Specialized Texas Instruments DS250DF810ABVT is a highly sophisticated interface IC designed for critical data transmission and signal conditioning applications. Encased in a 135FCBGA package, this specialized IC is engineered to enhance system reliability and performance in complex digital environments. Its advanced features are tailored for high-speed signal integrity, making it an indispensable component for developers looking to optimize their high-performance computing solutions. The integration of this IC in your systems ensures robust operation, minimizing signal loss and interference, crucial for maintaining efficiency and effectiveness in demanding applications.
DS250DF810ABVT Features
This interface IC from Texas Instruments boasts a range of features designed for specialized applications. Key features include high-speed data handling capabilities, advanced signal conditioning, and error checking functionalities which ensure data integrity during high-speed transmissions. The compact 135FCBGA packaging allows for efficient space utilization on PCBs, making it ideal for densely packed electronic assemblies. Additionally, its compatibility with multiple signaling standards adds to its versatility in various technological environments.
DS250DF810ABVT Applications
- Data Centers: Utilized in server interconnects to ensure rapid and reliable data transmission between servers, enhancing overall network efficiency.
- Telecommunications: Deployed in telecommunications equipment for high-speed signal processing, contributing to improved data throughput and reduced latency in communication networks.
- High-Performance Computing (HPC): Integral in supercomputers and HPC systems for handling massive data sets and complex computations without compromising on speed or accuracy.
- Industrial Automation: Applied in automated control systems where precision and robustness are required for managing and processing industrial data in real time.
- Medical Imaging: Used in medical imaging devices to process high-resolution images swiftly, ensuring clarity and precision in diagnostics.
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