DS250DF810ABVR

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Mfr.Part #
DS250DF810ABVR
Manufacturer
Texas Instruments
Package / Case
135-BGA Module
Datasheet
Download
Description
IC INTFACE SPECIALIZED 135FCBGA
Stock
1,563
In Stock :
1,563

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Manufacturer :
Texas Instruments
Product Category :
Specialized
Surface Mount :
yes
Number of Terminations :
135
Packaging :
Tape and Reel (TR)
Mounting Type :
Surface Mount
Number of Channels :
8
Height :
2.51mm
Min Operating Temperature :
-10°C
Number of Functions :
1
JESD-609 Code :
e1
Thickness :
580μm
Lifecycle Status :
ACTIVE (Last Updated: 3 days ago)
RoHS Status :
ROHS3 Compliant
Interface IC Type :
INTERFACE CIRCUIT
Moisture Sensitivity Level (MSL) :
2 (1 Year)
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Peak Reflow Temperature (Cel) :
260
Package / Case :
135-BGA Module
Base Part Number :
DS250DF810
Factory Lead Time :
8 Weeks
Number of Pins :
135
Terminal Position :
BOTTOM
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Temperature Grade :
Other
Max Operating Temperature :
85°C
Width :
8mm
Applications :
Retimer
Terminal Form :
Ball
Pbfree Code :
yes
Lead Free :
Lead Free
Length :
13mm
Datasheets
DS250DF810ABVR
Introducing Specialized Texas Instruments DS250DF810ABVR from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:135, Mounting Type:Surface Mount, Number of Channels:8, Package / Case:135-BGA Module, Base Part Number:DS250DF810, Number of Pins:135, DS250DF810ABVR pinout, DS250DF810ABVR datasheet PDF, DS250DF810ABVR amp .Beyond Specialized Texas Instruments DS250DF810ABVR ,we also offer DS90CR285MTDX/NOPB, USB2640I-HZH-02, LTC4316CMS#PBF, Our vast inventory has you covered. Contact us now for immediate solutions.

Texas Instruments DS250DF810ABVR


Specialized Texas Instruments DS250DF810ABVR Overview

The DS250DF810ABVR by Texas Instruments represents a cutting-edge solution in the specialized integrated circuits market, tailored specifically for high-performance interface applications. This IC, housed in a 135FCBGA package, is designed to manage complex signal integrity challenges efficiently. The DS250DF810ABVR stands out for its robust design and ability to streamline data-intensive operations, making it ideal for sectors demanding high precision and reliability. By integrating this product, businesses can significantly enhance system performance and reliability, promoting greater efficiency in technology-driven environments.

DS250DF810ABVR Features

The Texas Instruments DS250DF810ABVR boasts several features that distinguish it as a leader in interface technology. Key attributes include its high-speed signal conditioning capability, which is crucial for maintaining signal integrity across long distances and through various interfacing standards. Additionally, its compatibility with multiple data rates and protocols enhances its versatility in diverse applications. The device also emphasizes low power consumption and minimal latency, further underscoring its utility in high-performance settings.

DS250DF810ABVR Applications

  • Data Centers: Utilized for managing data flow and integrity across server connections, ensuring high-speed and reliable data communication.
  • Telecommunications: Applied in telecom infrastructures to enhance signal strength and quality, facilitating clearer and faster transmission of information.
  • Broadband Networking: Essential in broadband networks for boosting signal reliability and network efficiency, particularly in high-traffic scenarios.
  • Medical Imaging Equipment: Used in medical devices to ensure precise and rapid processing of complex imaging data, critical for accurate diagnostics.
  • Automotive Networking: Incorporated into automotive systems for improved data transmission capabilities, supporting advanced vehicle diagnostics and infotainment systems.
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