DS21Q554B+

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Mfr.Part #
DS21Q554B+
Manufacturer
Analog Devices, Inc.
Package / Case
256-BGA
Datasheet
Download
Description
IC TELECOM INTERFACE 256BGA
Stock
8,417
In Stock :
8,417

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Manufacturer :
Analog Devices, Inc.
Product Category :
Telecom
Package / Case :
256-BGA
Published :
1998
Radiation Hardening :
No
Operating Supply Voltage :
5V
RoHS Status :
ROHS3 Compliant
Number of Pins :
256
Number of Transceivers :
4
Function :
Transceiver
Factory Lead Time :
10 Weeks
Mount :
Surface Mount
Packaging :
Tray
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Base Part Number :
DS21Q554
Mounting Type :
Surface Mount
Interface :
e1
Voltage - Supply :
5V
Lead Free :
Lead Free
Datasheets
DS21Q554B+
Introducing Telecom Analog Devices, Inc. DS21Q554B+ from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:256-BGA, Number of Pins:256, Base Part Number:DS21Q554, Mounting Type:Surface Mount, DS21Q554B+ pinout, DS21Q554B+ datasheet PDF, DS21Q554B+ amp .Beyond Telecom Analog Devices, Inc. DS21Q554B+ ,we also offer CPC5712UTR, MT8870DS1, SI32176-C-FM1R, Our vast inventory has you covered. Contact us now for immediate solutions.

Analog Devices, Inc. DS21Q554B+


Telecom Analog Devices, Inc. DS21Q554B+ Overview

The DS21Q554B+ from Analog Devices, Inc. is a cutting-edge Integrated Circuit specifically designed for telecom interfaces. This high-performance IC is housed in a 256-ball BGA (Ball Grid Array) package, ensuring robust functionality in a compact form factor. The product is ideal for developers looking to integrate reliable telecom communication capabilities into their applications. By incorporating the Telecom Analog Devices, Inc. DS21Q554B+, manufacturers can expect not only enhanced performance but also greater efficiency and reliability in their telecom solutions.

DS21Q554B+ Features

This IC boasts a variety of features that make it a preferred choice for telecom applications. It supports multiple telecom standards, offering flexibility in deployment across different systems. The 256BGA packaging is designed for optimal thermal performance and minimal footprint on the circuit board. Moreover, its high-speed interface capabilities allow for efficient data transfer, making it suitable for high-demand telecom environments.

DS21Q554B+ Applications

  • High-Speed Networking Devices: Utilized for its robust data handling and speed optimization capabilities, enhancing performance in routers and switches.
  • Telecommunication Infrastructure: Essential for the core operations in telecommunications towers and base stations, providing reliable interfacing and connectivity.
  • VoIP Systems: Plays a crucial role in Voice over Internet Protocol technologies by ensuring efficient and stable signal conversion and transmission.
  • Wireless Communication Equipment: Supports the demand for high-speed wireless communication, ensuring seamless service in devices such as modems and wireless access points.
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