DPF308-998Z
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- Mfr.Part #
- DPF308-998Z
- Manufacturer
- Amphenol Communications Solutions
- Package / Case
- Datasheet
- Download
- Description
- CONN IC DIP SOCKET 8POS TIN-LEAD
- Stock
- 35,036
- In Stock ：
- 35,036
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- Manufacturer :
- Amphenol Communications Solutions
- Product Category :
- IC Sockets
- Feature :
- Open Frame
- Contact Finish - Mating :
- Tin-Lead
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Packaging :
- Tube
- PCB Contact Pattern :
- RECTANGULAR
- Mounting Type :
- Through Hole
- Type :
- DIP, 0.3 (7.62mm) Row Spacing
- Pitch - Mating :
- 0.100 2.54mm
- JESD-609 Code :
- e0
- Number of Contacts :
- 8
- Number of Positions or Pins (Grid) :
- 8 (2 x 4)
- Body Depth :
- 0.173 inch
- Mating Contact Pitch :
- 0.1 inch
- Operating Temperature (Min) :
- -55°C
- Series :
- DPF3
- Termination Post Length :
- 0.175 4.45mm
- Lead Length :
- 4.445mm
- Published :
- 2008
- Mount :
- Through Hole
- Body Breadth :
- 0.4 inch
- Dielectric Withstanding Voltage :
- 100VAC V
- Current Rating :
- 1A
- ECCN Code :
- EAR99
- Number of Pins :
- 8
- Contact Style :
- RND PIN-SKT
- Termination :
- Solder
- Contact Plating :
- Lead, Tin
- Pitch - Post :
- 0.100 2.54mm
- Additional Feature :
- DIP SOCKET, UL 94V-0
- Terminal Pitch :
- 2.54mm
- Contact Material - Post :
- Brass
- RoHS Status :
- Non-RoHS Compliant
- Housing Material :
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
- Insulation Resistance :
- 10000000000Ohm
- PCB Contact Row Spacing :
- 0.3 mm
- Contact Material - Mating :
- BERYLLIUM COPPER
- Contact Finish Thickness - Post :
- 200.0μin 5.08μm
- Operating Temperature (Max) :
- 125°C
- Flammability Rating :
- UL94 V-0
- Material Flammability Rating :
- UL94 V-0
- Contact Finish Thickness - Mating :
- 200.0μin 5.08μm
- Datasheets
- DPF308-998Z
DPF308-998Z datasheet pdf and Sockets for ICs, Transistors product details from Amphenol ICC (FCI) stock available at Xinshop
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