CYW15G0403DXB-BGI
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- Mfr.Part #
- CYW15G0403DXB-BGI
- Manufacturer
- Infineon Technologies
- Package / Case
- 256-LBGA Exposed Pad
- Datasheet
- Download
- Description
- IC TELECOM INTERFACE 256BGA
- Stock
- 4
- In Stock ：
- 4
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Telecom
- Series :
- HOTlink II™
- Mounting Type :
- Surface Mount
- Base Part Number :
- CY*15G04
- Width :
- 27mm
- Max Operating Temperature :
- 85°C
- Power Supplies :
- 3.3V
- Length :
- 27mm
- Supply Voltage :
- 3.3V
- Reach Compliance Code :
- not_compliant
- Terminal Position :
- BOTTOM
- Terminal Form :
- Ball
- Number of Functions :
- 1
- Voltage - Supply :
- 3.135V~3.465V
- Qualification Status :
- Not Qualified
- Terminal Pitch :
- 1.27mm
- Number of Terminations :
- 256
- Data Rate :
- 1500000 Mbps
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Min Operating Temperature :
- -40°C
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Nominal Supply Current :
- 1.32A
- Peak Reflow Temperature (Cel) :
- 225
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Mount :
- Surface Mount
- Number of Circuits :
- 4
- Number of Pins :
- 256
- Package / Case :
- 256-LBGA Exposed Pad
- Packaging :
- Tray
- Pin Count :
- 256
- Telecom IC Type :
- TELECOM CIRCUIT
- Temperature Grade :
- Industrial
- RoHS Status :
- Non-RoHS Compliant
- JESD-609 Code :
- e0
- Number of Transceivers :
- 4
- Datasheets
- CYW15G0403DXB-BGI
Telecom Infineon Technologies CYW15G0403DXB-BGI Overview
The Infineon Technologies CYW15G0403DXB-BGI is a high-performance IC telecom interface specifically designed to meet the rigorous demands of modern telecommunications infrastructure. This 256-ball grid array (BGA) integrated circuit offers exceptional reliability and functionality, making it an ideal choice for developers looking to enhance telecommunication systems. Its robust design ensures compatibility and easy integration with various telecommunications standards and protocols, facilitating rapid deployment and scalability in telecom networks.
CYW15G0403DXB-BGI Features
This IC telecom interface from Infineon Technologies features advanced signal processing capabilities, high-speed data transmission, and low power consumption. It supports a wide range of telecommunications applications, ensuring efficient and stable operation. The component's compact 256 BGA package allows for minimized board space usage, while providing the flexibility needed for sophisticated circuit designs.
CYW15G0403DXB-BGI Applications
- High-Speed Networks: Utilized in routers and switches, enhancing data throughput and reliability in high-speed telecommunications networks.
- Mobile Communication Infrastructure: Key component in base station transceivers, facilitating improved signal integrity and bandwidth management for mobile communications.
- VoIP Systems: Integral in Voice over IP (VoIP) gateways and equipment, ensuring clear and uninterrupted voice transmissions over internet protocol networks.
- Broadband Access: Used in broadband modems and access devices, enabling high-speed internet access and efficient data handling in residential and commercial environments.
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Shipping CostShipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.
The basic freight (for package ≤0.5 KG ) depends on the time zones and countries
Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.
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