CYD36S36V18-167BGXI

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Mfr.Part #
CYD36S36V18-167BGXI
Manufacturer
Infineon Technologies
Package / Case
484-FBGA
Datasheet
Download
Description
IC SRAM 36MBIT PARALLEL 484FBGA
Stock
43,406
In Stock :
43,406

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Address Bus Width :
20b
JESD-609 Code :
e1
Terminal Pitch :
1mm
Package / Case :
484-FBGA
Voltage - Supply :
1.42V~1.58V 1.7V~1.9V
Number of Pins :
484
Standby Current-Max :
0.7A
Base Part Number :
CYD36S36
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Access Time :
4ns
Pin Count :
484
Number of Functions :
1
Radiation Hardening :
No
Mount :
Surface Mount
Lead Free :
Lead Free
Standby Voltage-Min :
1.4V
Number of Terminations :
484
Memory Format :
SRAM
Output Characteristics :
3-STATE
Factory Lead Time :
15 Weeks
Organization :
1MX36
Nominal Supply Current :
1.47A
Terminal Position :
BOTTOM
Word Size :
36b
RoHS Status :
ROHS3 Compliant
Memory Size :
36Mb 1M x 36
Additional Feature :
PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V
Time@Peak Reflow Temperature-Max (s) :
30
Pbfree Code :
yes
Memory Width :
36
Supply Voltage :
1.5V
Sync/Async :
SYNCHRONOUS
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Operating Supply Voltage :
1.8V
Mounting Type :
Surface Mount
Memory Interface :
Parallel
Operating Temperature :
-40°C~85°C TA
Published :
2011
Memory Type :
Volatile
Number of Ports :
2
Packaging :
Tray
Density :
36 Mb
Supply Voltage-Max (Vsup) :
1.58V
Peak Reflow Temperature (Cel) :
260
I/O Type :
COMMON
Clock Frequency :
167MHz
Introducing Memory Infineon Technologies CYD36S36V18-167BGXI from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:484-FBGA, Number of Pins:484, Base Part Number:CYD36S36, Number of Terminations:484, Mounting Type:Surface Mount, Operating Temperature:-40°C~85°C TA, CYD36S36V18-167BGXI pinout, CYD36S36V18-167BGXI datasheet PDF, CYD36S36V18-167BGXI amp .Beyond Memory Infineon Technologies CYD36S36V18-167BGXI ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CYD36S36V18-167BGXI


Memory Infineon Technologies CYD36S36V18-167BGXI Overview

The Memory Infineon Technologies CYD36S36V18-167BGXI is a high-performance 36Mbit SRAM component, encapsulated in a 484FBGA package, designed by Infineon Technologies. This product combines advanced parallel interface technology with a dense memory layout, making it ideal for applications that require fast access and high reliability. This memory module is engineered to support demanding industrial and enterprise-level applications, ensuring robust performance under varying operational conditions. With its significant storage capacity and compact form factor, this SRAM is specifically crafted to meet the sophisticated needs of modern technology systems, thereby facilitating enhanced system efficiency and reliability.

CYD36S36V18-167BGXI Features

The CYD36S36V18-167BGXI SRAM features a parallel interface, offering high-speed data access and processing capabilities. Its 484FBGA packaging not only provides a protective and robust enclosure but also aids in efficient heat dissipation, essential for maintaining stability and performance under high operational loads. Additionally, the 36Mbit capacity allows for substantial data storage, making it suitable for complex processing tasks in advanced computing environments.

CYD36S36V18-167BGXI Applications

  • Networking Equipment: Utilized in routers and switches to manage and store routing tables efficiently, enabling quicker data packet processing and improved network traffic management.
  • Telecommunications: Essential for telecom systems, where fast and reliable data access is necessary for signal processing and real-time communication services.
  • Industrial Automation: Plays a critical role in automation systems, facilitating the high-speed operation of machine control units and real-time processing of sensor data.
  • Medical Devices: Used in various medical imaging and diagnostic equipment, providing the necessary speed and reliability for processing large amounts of patient data.
  • Aerospace and Defense: Ideal for applications in aerospace systems, where extreme conditions demand robust and reliable memory solutions for data logging and system control tasks.
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