CY7C1360C-166BZI
- Mfr.Part #
- CY7C1360C-166BZI
- Manufacturer
- Infineon Technologies
- Package / Case
- 165-LBGA
- Datasheet
- Download
- Description
- IC SRAM 9MBIT PARALLEL 165FBGA
- Stock
- 6,505
- In Stock :
- 6,505
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- Word Size :
- 36b
- Base Part Number :
- CY7C1360
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Mounting Type :
- Surface Mount
- Nominal Supply Current :
- 180mA
- Organization :
- 256KX36
- Reach Compliance Code :
- not_compliant
- JESD-609 Code :
- e0
- Supply Voltage-Min (Vsup) :
- 3.135V
- Supply Voltage-Max (Vsup) :
- 3.6V
- Memory Type :
- Volatile
- Peak Reflow Temperature (Cel) :
- 220
- Number of Pins :
- 165
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Memory Size :
- 9Mb 256K x 36
- Operating Supply Voltage :
- 3.3V
- Sync/Async :
- SYNCHRONOUS
- Address Bus Width :
- 18b
- Number of Terminations :
- 165
- Number of Ports :
- 4
- Package / Case :
- 165-LBGA
- Access Time :
- 3.5ns
- Length :
- 15mm
- Voltage - Supply :
- 3.135V~3.6V
- Lead Free :
- Contains Lead
- Memory Format :
- SRAM
- Clock Frequency :
- 166MHz
- Output Characteristics :
- 3-STATE
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Terminal Position :
- BOTTOM
- Memory Width :
- 36
- Operating Temperature :
- -40°C~85°C TA
- I/O Type :
- COMMON
- Terminal Pitch :
- 1mm
- Memory Interface :
- Parallel
- Packaging :
- Tray
- ECCN Code :
- 3A991.B.2.A
- Qualification Status :
- Not Qualified
- Number of Functions :
- 1
- Published :
- 2005
- Density :
- 9 Mb
- Additional Feature :
- PIPELINED ARCHITECTURE
- Supply Voltage :
- 3.3V
- Mount :
- Surface Mount
- Pin Count :
- 165
- RoHS Status :
- Non-RoHS Compliant
- Datasheets
- CY7C1360C-166BZI

Memory Infineon Technologies CY7C1360C-166BZI Overview
The Memory Infineon Technologies CY7C1360C-166BZI is a high-performance 9Mbit SRAM module designed by Infineon Technologies, tailored for applications requiring fast access and high data bandwidth. This IC SRAM features a parallel interface and is packaged in a compact 165FBGA form, making it ideal for dense board configurations in advanced digital systems. The robust design and manufacturing expertise of Infineon Technologies ensure that this memory component delivers reliability and high-speed data integrity, making it a preferred choice for B2B customers looking to enhance the performance and efficiency of their systems.
CY7C1360C-166BZI Features
The CY7C1360C-166BZI is built to handle complex applications with demanding memory requirements. Key features include its 9Mbit storage capacity, fast access time, and parallel interface, ensuring seamless integration into a variety of hardware setups. The chip's low power consumption and high data retention capabilities are especially beneficial in portable and high-speed computing environments, reinforcing its utility in both commercial and industrial applications.
CY7C1360C-166BZI Applications
- Advanced Networking Equipment: Utilized in routers and switches for caching and high-speed packet buffering, enhancing network efficiency and throughput.
- High-Performance Computing: Serves as temporary data storage in supercomputers and server farms, facilitating rapid access to frequently used data sets.
- Automotive Electronics: Used in automotive control units where quick data retrieval is crucial for real-time system responses.
- Industrial Automation: Employs in programmable logic controllers for managing operational sequences in automated manufacturing lines, improving system responsiveness and reliability.
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