CY7C1354B-166BGC
- Mfr.Part #
- CY7C1354B-166BGC
- Manufacturer
- Infineon Technologies
- Package / Case
- 119-BGA
- Datasheet
- Download
- Description
- IC SRAM 9MBIT PARALLEL 119PBGA
- Stock
- 26,341
- In Stock :
- 26,341
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- Supply Current-Max :
- 0.18mA
- Terminal Pitch :
- 1.27mm
- Output Characteristics :
- 3-STATE
- Base Part Number :
- CY7C1354
- Package / Case :
- 119-BGA
- Memory Density :
- 9437184 bit
- Length :
- 22mm
- Packaging :
- Tray
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- ECCN Code :
- 3A991.B.2.A
- Additional Feature :
- PIPELINED ARCHITECTURE
- Memory Width :
- 36
- Standby Voltage-Min :
- 3.14V
- Reach Compliance Code :
- not_compliant
- Operating Temperature :
- 0°C~70°C TA
- Surface Mount :
- yes
- JESD-609 Code :
- e0
- Organization :
- 256KX36
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Access Time :
- 3.5ns
- Clock Frequency :
- 166MHz
- Standby Current-Max :
- 0.035A
- Memory Interface :
- Parallel
- Lead Free :
- Contains Lead
- Peak Reflow Temperature (Cel) :
- 220
- Terminal Position :
- BOTTOM
- Qualification Status :
- Not Qualified
- Supply Voltage-Max (Vsup) :
- 3.63V
- HTS Code :
- 8542.32.00.41
- Memory Size :
- 9Mb 256K x 36
- JESD-30 Code :
- R-PBGA-B119
- RoHS Status :
- Non-RoHS Compliant
- Number of Terminations :
- 119
- Supply Voltage-Min (Vsup) :
- 3.135V
- Voltage - Supply :
- 3.135V~3.6V
- Memory Type :
- Volatile
- I/O Type :
- COMMON
- Power Supplies :
- 2.5/3.33.3V
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Published :
- 2004
- Pin Count :
- 119
- Height Seated (Max) :
- 2.4mm
- Supply Voltage :
- 3.3V
- Memory Format :
- SRAM
- Number of Functions :
- 1
- Width :
- 14mm
- Mounting Type :
- Surface Mount
- Datasheets
- CY7C1354B-166BGC

Memory Infineon Technologies CY7C1354B-166BGC Overview
The Memory Infineon Technologies CY7C1354B-166BGC is a high-performance IC SRAM device designed by Infineon Technologies, optimized for advanced, high-speed data storage and retrieval systems. With a substantial 9Mbit capacity and a fast 166 MHz clock speed, this SRAM module is engineered for applications requiring quick access to large volumes of data. Its robust 119-pin PBGA (Plastic Ball Grid Array) packaging ensures reliable connectivity and durability, making it an excellent choice for sophisticated electronics requiring high-speed memory operations. The integration of advanced technology and high capacity makes the CY7C1354B-166BGC ideal for B2B customers looking to enhance their systems' performance with reliable and efficient memory solutions.
CY7C1354B-166BGC Features
This SRAM unit boasts several features that set it apart in the competitive memory component market. Key features include its 9Mbit storage capacity, which facilitates extensive data handling capabilities. The parallel interface ensures compatibility with a wide range of existing technologies, while its high-speed functionality is supported by a 166 MHz clock frequency. Additionally, the device's 119PBGA packaging is not only compact but also offers excellent mechanical stability and thermal resilience, crucial for maintaining functionality under varying environmental conditions.
CY7C1354B-166BGC Applications
- Networking Equipment: Utilized in routers and switches for buffer memory, helping manage data flow efficiently across networks.
- Telecommunications: Deployed in telecommunications infrastructure to facilitate rapid access and storage of information, enhancing communication systems' response times.
- Industrial Automation: Applied in control systems to store temporary data for real-time processing, crucial for maintaining operational precision and speed.
- High-performance Computing: Used in servers and data centers where high-speed data retrieval and storage are necessary to handle large volumes of information effectively.
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