CY7C1024DV33-10BGXIT

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Mfr.Part #
CY7C1024DV33-10BGXIT
Manufacturer
Infineon Technologies
Package / Case
119-BGA
Datasheet
Download
Description
IC SRAM 3MBIT PARALLEL 119PBGA
Stock
48,543
In Stock :
48,543

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Memory Width :
24
Packaging :
Tape and Reel (TR)
Base Part Number :
CY7C1024
Terminal Position :
BOTTOM
Voltage - Supply :
3V~3.6V
RoHS Status :
ROHS3 Compliant
Time@Peak Reflow Temperature-Max (s) :
30
Operating Temperature :
-40°C~85°C TA
Length :
22mm
Standby Voltage-Min :
2V
Radiation Hardening :
No
Mount :
Surface Mount
I/O Type :
COMMON
Factory Lead Time :
8 Weeks
Word Size :
24b
Number of Terminations :
119
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Lead Free :
Lead Free
Number of Ports :
1
Pbfree Code :
yes
Supply Voltage :
3.3V
Sync/Async :
ASYNCHRONOUS
Memory Format :
SRAM
Mounting Type :
Surface Mount
Memory Type :
Volatile
Output Characteristics :
3-STATE
Address Bus Width :
17b
Supply Voltage-Max (Vsup) :
3.6V
Height Seated (Max) :
2.4mm
Write Cycle Time - Word, Page :
10ns
Memory Interface :
Parallel
Nominal Supply Current :
175mA
Supply Voltage-Min (Vsup) :
3V
Standby Current-Max :
0.025A
Package / Case :
119-BGA
Number of Pins :
119
Number of Functions :
1
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Size :
3Mb 128K x 24
Published :
2002
JESD-609 Code :
e1
Peak Reflow Temperature (Cel) :
260
Density :
3 Mb
Operating Supply Voltage :
3.3V
Introducing Memory Infineon Technologies CY7C1024DV33-10BGXIT from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:CY7C1024, Operating Temperature:-40°C~85°C TA, Number of Terminations:119, Mounting Type:Surface Mount, Package / Case:119-BGA, Number of Pins:119, CY7C1024DV33-10BGXIT pinout, CY7C1024DV33-10BGXIT datasheet PDF, CY7C1024DV33-10BGXIT amp .Beyond Memory Infineon Technologies CY7C1024DV33-10BGXIT ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY7C1024DV33-10BGXIT


Memory Infineon Technologies CY7C1024DV33-10BGXIT Overview

The Memory Infineon Technologies CY7C1024DV33-10BGXIT is a high-performance 3Mbit SRAM device, designed by Infineon Technologies for demanding applications that require rapid access to memory data. This SRAM IC operates with a parallel interface, ensuring efficient data transfer and high-speed operations. Packaged in a compact 119PBGA format, it offers robust reliability and is tailored to meet the stringent requirements of both industrial and commercial environments. The specialized design of CY7C1024DV33-10BGXIT provides an optimal solution for systems requiring fast access and high stability of data, making it a preferred choice for manufacturers looking to enhance system performance while maintaining footprint efficiency.

CY7C1024DV33-10BGXIT Features

The CY7C1024DV33-10BGXIT features include a storage capacity of 3Mbit with a parallel interface for rapid data access and processing. The device's 119PBGA package ensures a minimal footprint, making it ideal for space-constrained applications. It operates under a voltage range of 3.3V, optimizing power consumption for energy-efficient operations. The SRAM’s ability to perform under extended industrial temperature ranges enhances its usability in varied environmental conditions.

CY7C1024DV33-10BGXIT Applications

  • Networking Equipment: Utilized in routers and switches for fast data buffering and handling, ensuring efficient network management and high-speed data transmission.
  • Industrial Automation: Employed in control systems to provide rapid, reliable data storage and retrieval for real-time process control and monitoring.
  • Automotive Systems: Integrated into automotive electronics for fast data access in real-time applications, enhancing the performance and safety features of modern vehicles.
  • Medical Devices: Used in medical imaging systems where quick data access is crucial for high-resolution imaging and real-time diagnostic applications.
  • Telecommunications: Applied in telecommunications infrastructure to ensure fast processing and storage of information, improving system reliability and service delivery.
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