CDR32BP330BJSM

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Mfr.Part #
CDR32BP330BJSM
Manufacturer
KYOCERA AVX
Package / Case
1206
Datasheet
Download
Description
CAP CER SMP MLC HI-REL
Stock
36,248
In Stock :
36,248

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Manufacturer :
KYOCERA AVX
Product Category :
Ceramic Capacitors
Thickness :
1.3mm
Reference Standard :
MIL-PRF-55681
Terminal Shape :
WRAPAROUND
Number of Terminations :
2
Terminal Finish :
Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier
Length :
3.2mm
JESD-609 Code :
e0
Max Operating Temperature :
125°C
Packing Method :
TR, 7 INCH
Temperature Coefficient :
30ppm/Cel ppm/°C
Temperature Characteristics Code :
BP
Dielectric Material :
Ceramic
Package / Case :
1206
Capacitance :
33pF
Min Operating Temperature :
-55°C
HTS Code :
8532.24.00.20
Width :
1.6mm
Multilayer :
yes
Factory Lead Time :
17 Weeks
Tolerance :
5%
Product Width :
3.2 x 1.6 x 1.3
Published :
2005
Series :
C(SIZE)N
RoHS Status :
RoHS Compliant
Dielectric :
C0G
Mount :
Surface Mount
Depth :
1.6mm
Voltage - Rated DC :
100V
Qualification :
MIL-PRF-55681
Product Length :
3.2 mm
ECCN Code :
EAR99
Pbfree Code :
No
Datasheets
CDR32BP330BJSM
Introducing Ceramic Capacitors KYOCERA AVX CDR32BP330BJSM from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:2, Package / Case:1206, CDR32BP330BJSM pinout, CDR32BP330BJSM datasheet PDF, CDR32BP330BJSM amp .Beyond Ceramic Capacitors KYOCERA AVX CDR32BP330BJSM ,we also offer CL10B104KB8NNNL, CL03A104KP3NNNC, GRM033Z71C104KE14D, Our vast inventory has you covered. Contact us now for immediate solutions.



C(SIZE)N Series 33pF 5% 2 Terminations 30ppm/Cel ppm/°C 1206 Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier 100V Ceramic Surface Mount Yes

CDR32BP330BJSM Overview


Temperature coefficient = 30ppm/Cel ppm/°C.There is a case 1206 that contains the product.Normally, this electrical part will operate at a voltage of 100V volts DC.

CDR32BP330BJSM Features


A temperature coefficient of 30ppm/Cel ppm/°C


CDR32BP330BJSM Applications


There are a lot of KEMET
CDR32BP330BJSM applications of capacitor networks.


  • Professional electronics
  • High density consumer electronics
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