CD74HCT574QPWRQ1

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Mfr.Part #
CD74HCT574QPWRQ1
Manufacturer
Texas Instruments
Package / Case
20-TSSOP (0.173, 4.40mm Width)
Datasheet
Download
Description
IC FF D-TYPE SNGL 8BIT 20TSSOP
Stock
13,129
In Stock :
13,129

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Manufacturer :
Texas Instruments
Product Category :
Flip Flops
Terminal Form :
Gull wing
Lead Free :
Contains Lead
Pbfree Code :
No
Family :
HCT
Function :
Standard
Number of Circuits :
8
Terminal Position :
Dual
Trigger Type :
POSITIVE EDGE
Turn On Delay Time :
15 ns
Power Supplies :
5V
Load Capacitance :
50pF
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Polarity :
Non-Inverting
Number of Terminations :
20
Max Propagation Delay @ V, Max CL :
33ns @ 4.5V, 50pF
Packing Method :
Tape and Reel
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Length :
6.5mm
Supply Voltage-Min (Vsup) :
4.5V
Number of Output Lines :
3
Supply Voltage-Max (Vsup) :
5.5V
Mounting Type :
Surface Mount
Qualification Status :
Not Qualified
Number of Ports :
2
Max I(ol) :
0.006 A
Base Part Number :
74HCT574
Number of Pins :
20
Clock Edge Trigger Type :
POSITIVE EDGE
Number of Bits :
8
Clock Frequency :
60MHz
Width :
4.4mm
Current - Quiescent (Iq) :
8μA
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Operating Temperature :
-40°C~125°C TA
Propagation Delay :
33 ns
Mount :
Surface Mount
Type :
D-Type
Packaging :
Tape and Reel (TR)
Series :
Automotive, AEC-Q100, 74HCT
Output Type :
Tri-State, Non-Inverted
Voltage - Supply :
4.5V~5.5V
Current - Output High, Low :
6mA 6mA
Supply Voltage :
5V
Weight :
76.997305mg
Input Capacitance :
10pF
Number of Elements :
1
Package / Case :
20-TSSOP (0.173, 4.40mm Width)
Terminal Pitch :
0.65mm
RoHS Status :
ROHS3 Compliant
Logic Function :
D-Type, Flip-Flop
Datasheets
CD74HCT574QPWRQ1
Introducing Flip Flops Texas Instruments CD74HCT574QPWRQ1 from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:20, Mounting Type:Surface Mount, Base Part Number:74HCT574, Number of Pins:20, Operating Temperature:-40°C~125°C TA, Type:D-Type, Package / Case:20-TSSOP (0.173, 4.40mm Width), CD74HCT574QPWRQ1 pinout, CD74HCT574QPWRQ1 datasheet PDF, CD74HCT574QPWRQ1 amp .Beyond Flip Flops Texas Instruments CD74HCT574QPWRQ1 ,we also offer MC100EP29MNG, 74AHC1G79GW,165, 74AHC1G79GW,125, Our vast inventory has you covered. Contact us now for immediate solutions.

Texas Instruments CD74HCT574QPWRQ1


[Flip Flops Texas Instruments CD74HCT574QPWRQ1] Overview

Introducing the cutting-edge CD74HCT574QPWRQ1, meticulously crafted by Texas Instruments to redefine the landscape of Flip Flops technology. Engineered with precision and finesse, this Integrated Circuit (IC) stands as a testament to innovation and reliability in electronic components. Designed to deliver unparalleled performance, it is tailored to meet the exacting standards of modern industrial applications.

CD74HCT574QPWRQ1 Features

  • High-quality Single 8-bit D-Type Flip Flop
  • 20-pin Thin Shrink Small Outline Package (TSSOP)
  • Optimized for seamless integration and functionality
  • Exceptional durability and robustness for extended usage
  • Precision engineering ensures reliable operation in diverse conditions

CD74HCT574QPWRQ1 Applications

  • Industrial Automation: This IC finds its application in industrial automation systems, facilitating seamless data storage and retrieval processes in manufacturing units. Its robust design ensures stable performance in harsh industrial environments, making it an ideal choice for automated control systems.
  • Communication Equipment: Integrated into communication devices, the CD74HCT574QPWRQ1 enhances data processing and transmission efficiency. Its high-speed operation and low power consumption make it indispensable in telecommunications infrastructure, ensuring reliable connectivity and seamless operation.
  • Consumer Electronics: From smart appliances to gaming consoles, this IC powers a myriad of consumer electronics products. Its compact form factor and versatile functionality make it an essential component in modern electronic devices, enabling seamless data handling and processing for enhanced user experiences.
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