CC45SL3DD820JYNNA

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Mfr.Part #
CC45SL3DD820JYNNA
Manufacturer
TDK Corporation
Package / Case
Radial, Disc
Datasheet
Download
Description
CAP CER 82PF 2KV SL RADIAL
Stock
43,030
In Stock :
43,030

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Manufacturer :
TDK Corporation
Product Category :
Ceramic Capacitors
Temperature Characteristics Code :
SL
Height Seated (Max) :
0.433 11.00mm
Size / Dimension :
0.276Dia 7.00mm
Package / Case :
Radial, Disc
Dielectric Material :
Ceramic
Rated (DC) Voltage (URdc) :
2000V
Lead/Base Style :
Straight
Factory Lead Time :
10 Weeks
Published :
2001
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Multilayer :
No
Terminal Pitch :
5mm
Lead Pitch :
5.0038mm
Lead Spacing :
0.197 5.00mm
RoHS Status :
ROHS3 Compliant
Number of Terminations :
2
Voltage - Rated :
2000V 2kV
JESD-609 Code :
e3
Lead Style :
Formed Leads - Kinked
Mount :
Through Hole
Terminal Shape :
Wire
Length :
7mm
Capacitor Type :
CERAMIC CAPACITOR
ECCN Code :
EAR99
Temperature Coefficient :
SL
Series :
CC45
Packaging :
Bulk
Width :
5mm
Pbfree Code :
yes
Capacitance :
82pF
Mounting Type :
Through Hole
Size Code :
2820
Applications :
GENERAL PURPOSE
Feature :
High Voltage, Low Dissipation Factor
HTS Code :
8532.23.00.60
Contact Plating :
Tin
Operating Temperature :
-25°C~125°C
Tolerance :
±5%
Lifecycle Status :
Production (Last Updated: 2 months ago)
Datasheets
CC45SL3DD820JYNNA
Introducing Ceramic Capacitors TDK Corporation CC45SL3DD820JYNNA from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:Radial, Disc, Number of Terminations:2, Mounting Type:Through Hole, Operating Temperature:-25°C~125°C, CC45SL3DD820JYNNA pinout, CC45SL3DD820JYNNA datasheet PDF, CC45SL3DD820JYNNA amp .Beyond Ceramic Capacitors TDK Corporation CC45SL3DD820JYNNA ,we also offer CL10B104KB8NNNL, CL03A104KP3NNNC, GRM033Z71C104KE14D, Our vast inventory has you covered. Contact us now for immediate solutions.

TDK Corporation CC45SL3DD820JYNNA


CC45 82pF 2000V 2kV Ceramic Capacitor ±5% SL 0.276Dia 7.00mm -25°C~125°C 2 Terminations High Voltage, Low Dissipation Factor Through Hole Radial, Disc

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