CC45SL3DD680JYNNA

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Mfr.Part #
CC45SL3DD680JYNNA
Manufacturer
TDK Corporation
Package / Case
Radial, Disc
Datasheet
Download
Description
CAP CER 68PF 2KV SL RADIAL
Stock
42,100
In Stock :
42,100

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Manufacturer :
TDK Corporation
Product Category :
Ceramic Capacitors
ECCN Code :
EAR99
Height Seated (Max) :
0.413 10.50mm
Tolerance :
±5%
Applications :
GENERAL PURPOSE
Terminal Shape :
Wire
Lead Spacing :
0.197 5.00mm
Size Code :
2620
Series :
CC45
Mounting Type :
Through Hole
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Mount :
Through Hole
Rated (DC) Voltage (URdc) :
2000V
RoHS Status :
ROHS3 Compliant
Multilayer :
No
Dielectric Material :
Ceramic
Operating Temperature :
-25°C~125°C
Number of Terminations :
2
Length :
6.5mm
Lifecycle Status :
Production (Last Updated: 1 month ago)
Lead Style :
Formed Leads - Kinked
Width :
5mm
Factory Lead Time :
10 Weeks
Pbfree Code :
yes
HTS Code :
8532.23.00.60
Capacitor Type :
CERAMIC CAPACITOR
Capacitance :
68pF
Size / Dimension :
0.256Dia 6.50mm
Voltage - Rated :
2000V 2kV
Temperature Coefficient :
SL
Package / Case :
Radial, Disc
Lead Pitch :
5.0038mm
Terminal Pitch :
5mm
Lead/Base Style :
Straight
Contact Plating :
Tin
Packaging :
Bulk
JESD-609 Code :
e3
Temperature Characteristics Code :
SL
Feature :
High Voltage, Low Dissipation Factor
Published :
2001
Datasheets
CC45SL3DD680JYNNA
Introducing Ceramic Capacitors TDK Corporation CC45SL3DD680JYNNA from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Through Hole, Operating Temperature:-25°C~125°C, Number of Terminations:2, Package / Case:Radial, Disc, CC45SL3DD680JYNNA pinout, CC45SL3DD680JYNNA datasheet PDF, CC45SL3DD680JYNNA amp .Beyond Ceramic Capacitors TDK Corporation CC45SL3DD680JYNNA ,we also offer CL10B104KB8NNNL, CL03A104KP3NNNC, GRM033Z71C104KE14D, Our vast inventory has you covered. Contact us now for immediate solutions.

TDK Corporation CC45SL3DD680JYNNA


CC45 68pF 2000V 2kV Ceramic Capacitor ±5% SL 0.256Dia 6.50mm -25°C~125°C 2 Terminations High Voltage, Low Dissipation Factor Through Hole Radial, Disc

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