CC45SL3DD470JYNNA

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Mfr.Part #
CC45SL3DD470JYNNA
Manufacturer
TDK Corporation
Package / Case
Radial, Disc
Datasheet
Download
Description
CAP CER 47PF 2KV SL RADIAL
Stock
45,659
In Stock :
45,659

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Manufacturer :
TDK Corporation
Product Category :
Ceramic Capacitors
Capacitance :
47pF
Tolerance :
±5%
Series :
CC45
Length :
5.5mm
Lead Spacing :
0.197 5.00mm
Lead Pitch :
5.0038mm
Applications :
GENERAL PURPOSE
Contact Plating :
Tin
Mounting Type :
Through Hole
Size / Dimension :
0.217Dia 5.50mm
Factory Lead Time :
30 Weeks
Lifecycle Status :
Production (Last Updated: 2 months ago)
Number of Terminations :
2
Temperature Coefficient :
SL
HTS Code :
8532.23.00.60
Terminal Pitch :
5mm
Package / Case :
Radial, Disc
Lead Style :
Formed Leads - Kinked
Feature :
High Voltage, Low Dissipation Factor
Size Code :
2220
Terminal Shape :
Wire
Dielectric Material :
Ceramic
Height Seated (Max) :
0.374 9.50mm
Rated (DC) Voltage (URdc) :
2000V
Width :
5mm
Published :
2001
Multilayer :
No
Operating Temperature :
-25°C~125°C
JESD-609 Code :
e3
ECCN Code :
EAR99
RoHS Status :
ROHS3 Compliant
Packaging :
Bulk
Lead/Base Style :
Straight
Capacitor Type :
CERAMIC CAPACITOR
Pbfree Code :
yes
Voltage - Rated :
2000V 2kV
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Mount :
Through Hole
Temperature Characteristics Code :
SL
Datasheets
CC45SL3DD470JYNNA
Introducing Ceramic Capacitors TDK Corporation CC45SL3DD470JYNNA from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Through Hole, Number of Terminations:2, Package / Case:Radial, Disc, Operating Temperature:-25°C~125°C, CC45SL3DD470JYNNA pinout, CC45SL3DD470JYNNA datasheet PDF, CC45SL3DD470JYNNA amp .Beyond Ceramic Capacitors TDK Corporation CC45SL3DD470JYNNA ,we also offer CL10B104KB8NNNL, CL03A104KP3NNNC, GRM033Z71C104KE14D, Our vast inventory has you covered. Contact us now for immediate solutions.

TDK Corporation CC45SL3DD470JYNNA


CC45 47pF 2000V 2kV Ceramic Capacitor ±5% SL 0.217Dia 5.50mm -25°C~125°C 2 Terminations High Voltage, Low Dissipation Factor Through Hole Radial, Disc

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