CC45SL3DD271JYNNA

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Mfr.Part #
CC45SL3DD271JYNNA
Manufacturer
TDK Corporation
Package / Case
Radial, Disc
Datasheet
Download
Description
CAP CER 270PF 2KV SL RADIAL
Stock
402
In Stock :
402

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Manufacturer :
TDK Corporation
Product Category :
Ceramic Capacitors
Contact Plating :
Tin
Multilayer :
No
HTS Code :
8532.23.00.60
Factory Lead Time :
10 Weeks
Lead Pitch :
5.0038mm
Voltage - Rated :
2000V 2kV
Lifecycle Status :
Production (Last Updated: 2 months ago)
Dielectric Material :
Ceramic
Capacitance :
270pF
Temperature Characteristics Code :
SL
Terminal Shape :
Wire
Number of Terminations :
2
Lead Spacing :
0.295 7.50mm
Published :
2001
Terminal Pitch :
7.5mm
Height Seated (Max) :
0.591 15.00mm
ECCN Code :
EAR99
Packaging :
Bulk
Temperature Coefficient :
SL
Rated (DC) Voltage (URdc) :
2000V
Size / Dimension :
0.433Dia 11.00mm
Package / Case :
Radial, Disc
Applications :
GENERAL PURPOSE
Lead/Base Style :
Straight
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Width :
5mm
Feature :
High Voltage, Low Dissipation Factor
Lead Style :
Formed Leads - Kinked
Pbfree Code :
yes
Capacitor Type :
CERAMIC CAPACITOR
Tolerance :
±5%
Length :
11mm
RoHS Status :
ROHS3 Compliant
Size Code :
4320
Mount :
Through Hole
Series :
CC45
Operating Temperature :
-25°C~125°C
Mounting Type :
Through Hole
JESD-609 Code :
e3
Datasheets
CC45SL3DD271JYNNA
Introducing Ceramic Capacitors TDK Corporation CC45SL3DD271JYNNA from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:2, Package / Case:Radial, Disc, Operating Temperature:-25°C~125°C, Mounting Type:Through Hole, CC45SL3DD271JYNNA pinout, CC45SL3DD271JYNNA datasheet PDF, CC45SL3DD271JYNNA amp .Beyond Ceramic Capacitors TDK Corporation CC45SL3DD271JYNNA ,we also offer CL10B104KB8NNNL, CL03A104KP3NNNC, GRM033Z71C104KE14D, Our vast inventory has you covered. Contact us now for immediate solutions.

TDK Corporation CC45SL3DD271JYNNA


CC45 270pF 2000V 2kV Ceramic Capacitor ±5% SL 0.433Dia 11.00mm -25°C~125°C 2 Terminations High Voltage, Low Dissipation Factor Through Hole Radial, Disc

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