CC45SL3DD150JYNNA

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Mfr.Part #
CC45SL3DD150JYNNA
Manufacturer
TDK Corporation
Package / Case
Radial, Disc
Datasheet
Download
Description
CAP CER 15PF 2KV SL RADIAL
Stock
18,218
In Stock :
18,218

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Manufacturer :
TDK Corporation
Product Category :
Ceramic Capacitors
Height Seated (Max) :
0.374 9.50mm
Factory Lead Time :
10 Weeks
ECCN Code :
EAR99
Rated (DC) Voltage (URdc) :
2000V
Package / Case :
Radial, Disc
JESD-609 Code :
e3
RoHS Status :
ROHS3 Compliant
Width :
5mm
Pbfree Code :
yes
Temperature Characteristics Code :
SL
Length :
5.5mm
Operating Temperature :
-25°C~125°C
Mounting Type :
Through Hole
Temperature Coefficient :
SL
Lead Spacing :
0.197 5.00mm
Terminal Shape :
Wire
Published :
2001
Mount :
Through Hole
Terminal Pitch :
5mm
Number of Terminations :
2
Capacitor Type :
CERAMIC CAPACITOR
Tolerance :
±5%
Voltage - Rated :
2000V 2kV
Size Code :
2220
Packaging :
Bulk
Multilayer :
No
Feature :
High Voltage, Low Dissipation Factor
Lead Style :
Formed Leads - Kinked
Size / Dimension :
0.217Dia 5.50mm
Dielectric Material :
Ceramic
Lead/Base Style :
Straight
Lifecycle Status :
Production (Last Updated: 2 months ago)
HTS Code :
8532.23.00.60
Contact Plating :
Tin
Series :
CC45
Lead Pitch :
5.0038mm
Applications :
GENERAL PURPOSE
Capacitance :
15pF
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Datasheets
CC45SL3DD150JYNNA
Introducing Ceramic Capacitors TDK Corporation CC45SL3DD150JYNNA from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:Radial, Disc, Operating Temperature:-25°C~125°C, Mounting Type:Through Hole, Number of Terminations:2, CC45SL3DD150JYNNA pinout, CC45SL3DD150JYNNA datasheet PDF, CC45SL3DD150JYNNA amp .Beyond Ceramic Capacitors TDK Corporation CC45SL3DD150JYNNA ,we also offer CL10B104KB8NNNL, CL03A104KP3NNNC, GRM033Z71C104KE14D, Our vast inventory has you covered. Contact us now for immediate solutions.

TDK Corporation CC45SL3DD150JYNNA


CC45 15pF 2000V 2kV Ceramic Capacitor ±5% SL 0.217Dia 5.50mm -25°C~125°C 2 Terminations High Voltage, Low Dissipation Factor Through Hole Radial, Disc

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