CC45SL3DD120JYNNA

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Mfr.Part #
CC45SL3DD120JYNNA
Manufacturer
TDK Corporation
Package / Case
Radial, Disc
Datasheet
Download
Description
CAP CER 12PF 2KV SL RADIAL
Stock
25,815
In Stock :
25,815

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Manufacturer :
TDK Corporation
Product Category :
Ceramic Capacitors
Mount :
Through Hole
HTS Code :
8532.23.00.60
Applications :
GENERAL PURPOSE
Published :
2001
Capacitance :
12pF
Temperature Coefficient :
SL
Lead Pitch :
5.0038mm
Lead Spacing :
0.197 5.00mm
Rated (DC) Voltage (URdc) :
2000V
Feature :
High Voltage, Low Dissipation Factor
Number of Terminations :
2
Lifecycle Status :
Production (Last Updated: 2 months ago)
Width :
5mm
Mounting Type :
Through Hole
Size Code :
2220
Tolerance :
±5%
Packaging :
Bulk
Factory Lead Time :
10 Weeks
Pbfree Code :
yes
JESD-609 Code :
e3
Size / Dimension :
0.217Dia 5.50mm
Length :
5.5mm
Series :
CC45
Package / Case :
Radial, Disc
Height Seated (Max) :
0.374 9.50mm
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Multilayer :
No
Dielectric Material :
Ceramic
Terminal Shape :
Wire
Capacitor Type :
CERAMIC CAPACITOR
Voltage - Rated :
2000V 2kV
ECCN Code :
EAR99
RoHS Status :
ROHS3 Compliant
Lead Style :
Formed Leads - Kinked
Terminal Pitch :
5mm
Operating Temperature :
-25°C~125°C
Contact Plating :
Tin
Temperature Characteristics Code :
SL
Lead/Base Style :
Straight
Datasheets
CC45SL3DD120JYNNA
Introducing Ceramic Capacitors TDK Corporation CC45SL3DD120JYNNA from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:2, Mounting Type:Through Hole, Package / Case:Radial, Disc, Operating Temperature:-25°C~125°C, CC45SL3DD120JYNNA pinout, CC45SL3DD120JYNNA datasheet PDF, CC45SL3DD120JYNNA amp .Beyond Ceramic Capacitors TDK Corporation CC45SL3DD120JYNNA ,we also offer CL10B104KB8NNNL, CL03A104KP3NNNC, GRM033Z71C104KE14D, Our vast inventory has you covered. Contact us now for immediate solutions.

TDK Corporation CC45SL3DD120JYNNA


CC45 12pF 2000V 2kV Ceramic Capacitor ±5% SL 0.217Dia 5.50mm -25°C~125°C 2 Terminations High Voltage, Low Dissipation Factor Through Hole Radial, Disc

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