CC45SL3AD680JYNNA

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Mfr.Part #
CC45SL3AD680JYNNA
Manufacturer
TDK Corporation
Package / Case
Radial, Disc
Datasheet
Download
Description
CAP CER 68PF 1KV SL RADIAL
Stock
15,418
In Stock :
15,418

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Manufacturer :
TDK Corporation
Product Category :
Ceramic Capacitors
Size / Dimension :
0.217Dia 5.50mm
HTS Code :
8532.23.00.60
Temperature Coefficient :
SL
Tolerance :
±5%
Pbfree Code :
yes
Rated (DC) Voltage (URdc) :
1000V
Height Seated (Max) :
0.374 9.50mm
Contact Plating :
Tin
Terminal Pitch :
5mm
Lead Spacing :
0.197 5.00mm
Size Code :
2220
Temperature Characteristics Code :
SL
RoHS Status :
ROHS3 Compliant
Capacitance :
68pF
JESD-609 Code :
e3
Capacitor Type :
CERAMIC CAPACITOR
Mount :
Through Hole
ECCN Code :
EAR99
Feature :
High Voltage, Low Dissipation Factor
Applications :
GENERAL PURPOSE
Lead/Base Style :
Straight
Length :
5.5mm
Packaging :
Bulk
Operating Temperature :
-25°C~125°C
Factory Lead Time :
10 Weeks
Number of Terminations :
2
Mounting Type :
Through Hole
Dielectric Material :
Ceramic
Voltage - Rated :
1000V 1kV
Lead Pitch :
5.0038mm
Published :
2001
Series :
CC45
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Package / Case :
Radial, Disc
Lead Style :
Formed Leads - Kinked
Terminal Shape :
Wire
Multilayer :
No
Lifecycle Status :
Production (Last Updated: 1 month ago)
Width :
5mm
Datasheets
CC45SL3AD680JYNNA
Introducing Ceramic Capacitors TDK Corporation CC45SL3AD680JYNNA from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-25°C~125°C, Number of Terminations:2, Mounting Type:Through Hole, Package / Case:Radial, Disc, CC45SL3AD680JYNNA pinout, CC45SL3AD680JYNNA datasheet PDF, CC45SL3AD680JYNNA amp .Beyond Ceramic Capacitors TDK Corporation CC45SL3AD680JYNNA ,we also offer CL10B104KB8NNNL, CL03A104KP3NNNC, GRM033Z71C104KE14D, Our vast inventory has you covered. Contact us now for immediate solutions.

TDK Corporation CC45SL3AD680JYNNA


CC45 68pF 1000V 1kV Ceramic Capacitor ±5% SL 0.217Dia 5.50mm -25°C~125°C 2 Terminations High Voltage, Low Dissipation Factor Through Hole Radial, Disc

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