CC45SL3AD390JYNNA

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Mfr.Part #
CC45SL3AD390JYNNA
Manufacturer
TDK Corporation
Package / Case
Radial, Disc
Datasheet
Download
Description
CAP CER 39PF 1KV SL RADIAL
Stock
30,812
In Stock :
30,812

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Manufacturer :
TDK Corporation
Product Category :
Ceramic Capacitors
Capacitor Type :
CERAMIC CAPACITOR
Terminal Shape :
Wire
Voltage - Rated :
1000V 1kV
JESD-609 Code :
e3
Size Code :
2220
RoHS Status :
ROHS3 Compliant
Pbfree Code :
yes
HTS Code :
8532.23.00.60
Dielectric Material :
Ceramic
Published :
2001
Lifecycle Status :
Production (Last Updated: 1 month ago)
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Rated (DC) Voltage (URdc) :
1000V
Feature :
High Voltage, Low Dissipation Factor
Factory Lead Time :
10 Weeks
Temperature Coefficient :
SL
Applications :
GENERAL PURPOSE
Lead Spacing :
0.197 5.00mm
Terminal Pitch :
5mm
Contact Plating :
Tin
Length :
5.5mm
Tolerance :
±5%
Width :
5mm
Package / Case :
Radial, Disc
Lead Style :
Formed Leads - Kinked
ECCN Code :
EAR99
Lead Pitch :
5.0038mm
Mount :
Through Hole
Mounting Type :
Through Hole
Multilayer :
No
Operating Temperature :
-25°C~125°C
Packaging :
Bulk
Temperature Characteristics Code :
SL
Number of Terminations :
2
Lead/Base Style :
Straight
Series :
CC45
Capacitance :
39pF
Height Seated (Max) :
0.374 9.50mm
Size / Dimension :
0.217Dia 5.50mm
Datasheets
CC45SL3AD390JYNNA
Introducing Ceramic Capacitors TDK Corporation CC45SL3AD390JYNNA from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:Radial, Disc, Mounting Type:Through Hole, Operating Temperature:-25°C~125°C, Number of Terminations:2, CC45SL3AD390JYNNA pinout, CC45SL3AD390JYNNA datasheet PDF, CC45SL3AD390JYNNA amp .Beyond Ceramic Capacitors TDK Corporation CC45SL3AD390JYNNA ,we also offer CL10B104KB8NNNL, CL03A104KP3NNNC, GRM033Z71C104KE14D, Our vast inventory has you covered. Contact us now for immediate solutions.

TDK Corporation CC45SL3AD390JYNNA


CC45 39pF 1000V 1kV Ceramic Capacitor ±5% SL 0.217Dia 5.50mm -25°C~125°C 2 Terminations High Voltage, Low Dissipation Factor Through Hole Radial, Disc

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