CC45SL3AD180JYNNA

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Mfr.Part #
CC45SL3AD180JYNNA
Manufacturer
TDK Corporation
Package / Case
Radial, Disc
Datasheet
Download
Description
CAP CER 18PF 1KV SL RADIAL
Stock
14,912
In Stock :
14,912

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Manufacturer :
TDK Corporation
Product Category :
Ceramic Capacitors
Size / Dimension :
0.217Dia 5.50mm
Rated (DC) Voltage (URdc) :
1000V
JESD-609 Code :
e3
Capacitor Type :
CERAMIC CAPACITOR
Mount :
Through Hole
Package / Case :
Radial, Disc
Factory Lead Time :
10 Weeks
Packaging :
Bulk
Dielectric Material :
Ceramic
Lead/Base Style :
Straight
Applications :
GENERAL PURPOSE
Series :
CC45
Lead Spacing :
0.197 5.00mm
Length :
5.5mm
Width :
5mm
Pbfree Code :
yes
Terminal Pitch :
5mm
ECCN Code :
EAR99
Lead Style :
Formed Leads - Kinked
HTS Code :
8532.23.00.60
Tolerance :
±5%
Lifecycle Status :
Production (Last Updated: 1 month ago)
Terminal Shape :
Wire
Multilayer :
No
Lead Pitch :
5.0038mm
Contact Plating :
Tin
RoHS Status :
ROHS3 Compliant
Feature :
High Voltage, Low Dissipation Factor
Temperature Characteristics Code :
SL
Temperature Coefficient :
SL
Operating Temperature :
-25°C~125°C
Voltage - Rated :
1000V 1kV
Mounting Type :
Through Hole
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Number of Terminations :
2
Size Code :
2220
Height Seated (Max) :
0.374 9.50mm
Capacitance :
18pF
Published :
2001
Datasheets
CC45SL3AD180JYNNA
Introducing Ceramic Capacitors TDK Corporation CC45SL3AD180JYNNA from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:Radial, Disc, Operating Temperature:-25°C~125°C, Mounting Type:Through Hole, Number of Terminations:2, CC45SL3AD180JYNNA pinout, CC45SL3AD180JYNNA datasheet PDF, CC45SL3AD180JYNNA amp .Beyond Ceramic Capacitors TDK Corporation CC45SL3AD180JYNNA ,we also offer CL10B104KB8NNNL, CL03A104KP3NNNC, GRM033Z71C104KE14D, Our vast inventory has you covered. Contact us now for immediate solutions.

TDK Corporation CC45SL3AD180JYNNA


CC45 18pF 1000V 1kV Ceramic Capacitor ±5% SL 0.217Dia 5.50mm -25°C~125°C 2 Terminations High Voltage, Low Dissipation Factor Through Hole Radial, Disc

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