BZX79-B36143

Manufacturer :

NXP Semiconductors

Product Category :

Specialized ICs

Contact Plating :

Tin

Packaging :

Tape and Box (TB)

Mount :

Through Hole

Pin Count :

2

Factory Lead Time :

6 Weeks

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

JESD-609 Code :

e3

Power Dissipation :

500mW

HTS Code :

8541.10.00.50

Number of Terminations :

2

Diode Element Material :

SILICON

Tolerance :

±2%

Reference Voltage :

36V

Number of Pins :

2

Peak Reflow Temperature (Cel) :

260

Polarity :

Unidirectional

ESD Protection :

No

ECCN Code :

EAR99

Number of Elements :

1

Max Reverse Leakage Current :

50nA

Voltage - Forward (Vf) (Max) @ If :

900mV @ 10mA

Test Current :

2mA

Package / Case :

DO-204AH, DO-35, Axial

Time@Peak Reflow Temperature-Max (s) :

30

Voltage Tolerance :

2%

Impedance :

90Ohm

Zener Voltage :

36V

Case Connection :

Isolated

Current - Reverse Leakage @ Vr :

50nA @ 25.2V

Element Configuration :

Single

Operating Temperature :

-65°C~200°C

Max Power Dissipation :

400mW

Voltage Tol-Max :

2%

Impedance-Max :

90Ohm

Reference Standard :

IEC-60134

Terminal Form :

Wire

Diode Type :

ZENER DIODE

Mounting Type :

Through Hole

RoHS Status :

ROHS3 Compliant