BZX585-C2V4135

Manufacturer :

NXP Semiconductors

Product Category :

Specialized ICs

Number of Elements :

1

Peak Reflow Temperature (Cel) :

260

Impedance :

100Ohm

Packaging :

Tape and Reel (TR)

Max Power Dissipation :

300mW

Time@Peak Reflow Temperature-Max (s) :

40

Diode Type :

ZENER DIODE

Mounting Type :

Surface Mount

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Power Dissipation :

300mW

Voltage - Forward (Vf) (Max) @ If :

1.1V @ 100mA

Current - Reverse Leakage @ Vr :

50μA @ 1V

ESD Protection :

No

Published :

2009

RoHS Status :

ROHS3 Compliant

JESD-609 Code :

e3

Polarity :

Unidirectional

Package / Case :

SC-79, SOD-523

Reference Voltage :

2.4V

Impedance-Max :

100Ohm

Mount :

Surface Mount

Tolerance :

±5%

Contact Plating :

Tin

Number of Pins :

2

Voltage Tol-Max :

5%

Terminal Form :

Flat

Zener Voltage :

2.4V

HTS Code :

8541.10.00.50

Test Current :

5mA

ECCN Code :

EAR99

Voltage Tolerance :

5%

Factory Lead Time :

4 Weeks

Max Reverse Leakage Current :

50μA

Terminal Position :

Dual

Pin Count :

2

Diode Element Material :

SILICON

Operating Temperature :

-65°C~150°C

Element Configuration :

Single

Number of Terminations :

2