BZV55-C2V4135

Manufacturer :

NXP Semiconductors

Product Category :

Specialized ICs

Contact Plating :

Tin

Package / Case :

DO-213AC, MINI-MELF, SOD-80

Current - Reverse Leakage @ Vr :

50μA @ 1V

Base Part Number :

BZV55C2V4

ESD Protection :

No

HTS Code :

8541.10.00.50

Mounting Type :

Surface Mount

Impedance :

100Ohm

Diode Element Material :

SILICON

Zener Voltage :

2.4V

Number of Elements :

1

Voltage Tolerance :

5%

Diode Type :

ZENER DIODE

ECCN Code :

EAR99

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Terminal Form :

WRAP AROUND

Case Connection :

Isolated

Packaging :

Tape and Reel (TR)

JESD-609 Code :

e3

Peak Reflow Temperature (Cel) :

260

Terminal Position :

END

Power Dissipation :

500mW

Tolerance :

±5%

Reference Voltage :

2.4V

Test Current :

5mA

Factory Lead Time :

6 Weeks

Number of Terminations :

2

Time@Peak Reflow Temperature-Max (s) :

30

RoHS Status :

ROHS3 Compliant

Polarity :

Unidirectional

Voltage Tol-Max :

5%

Number of Pins :

2

Pin Count :

2

Voltage - Forward (Vf) (Max) @ If :

900mV @ 10mA

Element Configuration :

Single

Operating Temperature :

-65°C~200°C

Impedance-Max :

100Ohm

Max Power Dissipation :

500mW

Max Reverse Leakage Current :

50μA

Mount :

Surface Mount