BZV55-C20135

Manufacturer :

NXP Semiconductors

Product Category :

Specialized ICs

Tolerance :

±5%

Max Reverse Leakage Current :

50nA

Zener Voltage :

20V

Number of Terminations :

2

RoHS Status :

ROHS3 Compliant

Test Current :

5mA

Factory Lead Time :

6 Weeks

Operating Temperature :

-65°C~200°C

Polarity :

Unidirectional

Power Dissipation :

500mW

Impedance-Max :

55Ohm

Peak Reflow Temperature (Cel) :

260

Impedance :

55Ohm

Mounting Type :

Surface Mount

Package / Case :

DO-213AC, MINI-MELF, SOD-80

Case Connection :

Isolated

Diode Type :

ZENER DIODE

Published :

2003

ECCN Code :

EAR99

Contact Plating :

Tin

ESD Protection :

No

JESD-609 Code :

e3

Diode Element Material :

SILICON

Time@Peak Reflow Temperature-Max (s) :

30

Base Part Number :

BZV55C20

Element Configuration :

Single

Packaging :

Tape and Reel (TR)

Mount :

Surface Mount

Reference Voltage :

20V

Terminal Position :

END

Voltage Tol-Max :

5%

Voltage - Forward (Vf) (Max) @ If :

900mV @ 10mA

Number of Pins :

2

Pin Count :

2

Current - Reverse Leakage @ Vr :

50nA @ 14V

Max Power Dissipation :

500mW

Number of Elements :

1

HTS Code :

8541.10.00.50

Terminal Form :

WRAP AROUND

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Voltage Tolerance :

5%