BR24T256FV-WE2

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Mfr.Part #
BR24T256FV-WE2
Manufacturer
ROHM Semiconductor
Package / Case
8-LSSOP (0.173, 4.40mm Width)
Datasheet
Download
Description
IC EEPROM 256K I2C 8SSOPB
Stock
2,500
In Stock :
2,500

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Manufacturer :
ROHM Semiconductor
Product Category :
Memory
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Access Time :
900 ns
Supply Current-Max :
0.0025mA
Base Part Number :
BR24T256
Write Protection :
Hardware
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Peak Reflow Temperature (Cel) :
225
Packaging :
Tape and Reel (TR)
Terminal Pitch :
0.65mm
Supply Voltage-Max (Vsup) :
5.5V
Package / Case :
8-LSSOP (0.173, 4.40mm Width)
Length :
4.4mm
Number of Pins :
8
Number of Terminations :
8
I2C Control Byte :
1010DDDR
Additional Feature :
SEATED HT-CALCULATED
Write Cycle Time - Word, Page :
5ms
Qualification Status :
Not Qualified
RoHS Status :
ROHS3 Compliant
Mounting Type :
Surface Mount
Density :
256 kb
Memory Type :
Non-Volatile
Memory Interface :
I2C
Interface :
2-Wire, I2C, Serial
Number of Functions :
1
Terminal Finish :
MATTE TIN
Operating Mode :
SYNCHRONOUS
Endurance :
1000000 Write/Erase Cycles
Published :
2013
Memory Size :
256Kb 32K x 8
Voltage - Supply :
1.6V~5.5V
Terminal Position :
Dual
Memory Format :
EEPROM
Width :
3mm
JESD-609 Code :
e3
Memory Width :
8
Standby Current-Max :
0.000002A
Height Seated (Max) :
1.35mm
Pbfree Code :
yes
Factory Lead Time :
6 Weeks
Clock Frequency :
400kHz
Operating Temperature :
-40°C~85°C TA
Mount :
Surface Mount
Serial Bus Type :
I2C
Data Retention Time-Min :
40
Write Cycle Time-Max (tWC) :
5ms
Supply Voltage-Min (Vsup) :
1.6V
Contact Plating :
Copper, Tin
Datasheets
BR24T256FV-WE2
Introducing Memory ROHM Semiconductor BR24T256FV-WE2 from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:BR24T256, Package / Case:8-LSSOP (0.173, 4.40mm Width), Number of Pins:8, Number of Terminations:8, Mounting Type:Surface Mount, Operating Temperature:-40°C~85°C TA, BR24T256FV-WE2 pinout, BR24T256FV-WE2 datasheet PDF, BR24T256FV-WE2 amp .Beyond Memory ROHM Semiconductor BR24T256FV-WE2 ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

ROHM Semiconductor BR24T256FV-WE2


Memory ROHM Semiconductor BR24T256FV-WE2 Overview

Introducing the cutting-edge EEPROM solution from ROHM Semiconductor, the BR24T256FV-WE2. This innovative IC EEPROM offers a capacity of 256K with I2C interface, packaged in a compact 8SSOPB form factor. Designed to meet the demanding requirements of modern electronic devices, this EEPROM stands out with its superior performance, reliability, and versatility.

ROHM Semiconductor, a leader in semiconductor technology, brings forth a product that combines high-density storage with seamless integration, catering to the diverse needs of industrial, automotive, consumer electronics, and other sectors.

BR24T256FV-WE2 Features

  • 256K capacity for ample data storage
  • I2C interface for easy integration and communication
  • 8SSOPB package for compact footprint
  • High reliability and endurance
  • Wide operating voltage range
  • Low power consumption for energy efficiency
  • Robust design for extended durability

BR24T256FV-WE2 Applications

  • Automotive Systems: Utilized in automotive electronics such as infotainment systems, engine control units (ECUs), and dashboard displays for data storage, firmware updates, and configuration settings. The BR24T256FV-WE2 ensures reliable performance and secure data retention in harsh automotive environments.
  • Industrial Automation: Integrated into industrial control systems, PLCs (Programmable Logic Controllers), and robotic applications for storing operational parameters, sensor data, and configuration files. Its compact size and robust features make it ideal for demanding industrial environments.
  • Consumer Electronics: Embedded in smart appliances, wearable devices, and IoT (Internet of Things) gadgets for storing user preferences, firmware, and sensor data. The BR24T256FV-WE2 offers seamless connectivity and efficient data management, enhancing the functionality of various consumer electronics products.
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