BGF117E6328XTSA1
- Mfr.Part #
- BGF117E6328XTSA1
- Manufacturer
- Infineon Technologies
- Package / Case
- 16-UFBGA, WLCSP
- Datasheet
- Download
- Description
- IC FILTER HSMMC ESD PROT WLP-16
- Stock
- 47,859
- In Stock :
- 47,859
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Specialized ICs
- Published :
- 2005
- Mount :
- Surface Mount
- Mounting Type :
- Surface Mount
- Packaging :
- Tape and Reel (TR)
- Base Part Number :
- BGF117
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- ECCN Code :
- EAR99
- Max Operating Temperature :
- 85°C
- Applications :
- HSMMC (High Speed Multi Media Card)
- HTS Code :
- 8504.50.80.00
- Type :
- Filter, HSMMC with ESD Protection
- RoHS Status :
- RoHS Compliant
- Reach Compliance Code :
- Unknown
- Package / Case :
- 16-UFBGA, WLCSP
- Datasheets
- BGF117E6328XTSA1

Specialized ICs Infineon Technologies BGF117E6328XTSA1 Overview
Specialized ICs Infineon Technologies BGF117E6328XTSA1 is a high-performance integrated circuit specifically designed for applications requiring robust ESD protection and RF filtering. Enclosed in a compact 16-UFBGA, WLCSP package, this IC integrates smoothly into Surface Mount technology systems. This product is delivered on Tape & Reel (TR) ensuring ease of handling and assembly. The BGF117E6328XTSA1 is optimized for High Speed Multi Media Card (HSMMC) interfaces, providing an essential shield against electrostatic discharge and signal interference, ensuring stability and integrity in sensitive applications. With an operational temperature range of -40°C to 85°C, it maintains functionality under various environmental conditions, making it an ideal choice for diverse industrial uses.
Key Features
The BGF117E6328XTSA1 offers several key features that make it a superior choice for critical applications:
- ESD Protection: Ensures durability and longevity of the device and connected components in electrically volatile environments.
- RF Filter Integration: Minimizes interference from RF signals, enhancing performance stability.
- Compact Form Factor: The 16-UFBGA, WLCSP packaging allows for minimal space consumption in crowded PCBs.
- Temperature Resilience: Operates effectively within a wide temperature range from -40°C to 85°C.
- Surface Mount Compatibility: Designed for easy integration into existing manufacturing processes without the need for through-hole components.
Applications
The versatility of the Specialized ICs Infineon Technologies BGF117E6328XTSA1 extends to various applications:
- High Speed Multi Media Card (HSMMC) platforms requiring precise signal control and protection.
- Industrial instruments that benefit from robust ESD protection.
- Consumer electronics where space and efficiency are at a premium.
- Medical devices needing dependable performance under stringent conditions.
- IoT devices and smart nodes demanding secure, reliable operations.
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