BAT74S135

Manufacturer :

NXP Semiconductors

Product Category :

Specialized ICs

Terminal Position :

Dual

RoHS Status :

ROHS3 Compliant

Mount :

Surface Mount

Peak Non-Repetitive Surge Current :

600mA

Max Operating Temperature :

125°C

Peak Reflow Temperature (Cel) :

260

Mounting Type :

Surface Mount

Reverse Recovery Time :

5 ns

Recovery Time :

5 ns

Diode Type :

Schottky

Forward Current :

200mA

Max Reverse Voltage (DC) :

30V

Power Dissipation-Max :

0.24W

Forward Voltage :

800mV

Average Rectified Current :

200mA

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Speed :

Small Signal =< 200mA (Io), Any Speed

ECCN Code :

EAR99

Number of Elements :

2

Terminal Form :

Gull wing

JESD-609 Code :

e3

Peak Reverse Current :

2µA

Operating Temperature - Junction :

125°C Max

Factory Lead Time :

4 Weeks

Output Current-Max :

0.2A

Diode Element Material :

SILICON

Pin Count :

6

HTS Code :

8541.10.00.70

Radiation Hardening :

No

Diode Configuration :

2 Independent

Max Reverse Leakage Current :

2µA

Voltage - Forward (Vf) (Max) @ If :

800mV @ 100mA

Current - Reverse Leakage @ Vr :

2μA @ 25V

Contact Plating :

Tin

Time@Peak Reflow Temperature-Max (s) :

30

Number of Terminations :

6

Max Surge Current :

600mA

Published :

2012

Max Repetitive Reverse Voltage (Vrrm) :

30V

Base Part Number :

BAT74S

Number of Pins :

6

Current - Average Rectified (Io) :

200mA DC

Package / Case :

6-TSSOP, SC-88, SOT-363

Packaging :

Tape and Reel (TR)