BAT54,215

Manufacturer :

NXP Semiconductors

Product Category :

Unclassified

Ambient Temperature Range High :

150°C

Power Dissipation-Max :

0.25W

Current - Reverse Leakage @ Vr :

2μA @ 25V

Pin Count :

3

Forward Current :

200mA

Mounting Type :

Surface Mount

Speed :

Small Signal =< 200mA (Io), Any Speed

RoHS Status :

ROHS3 Compliant

Package / Case :

TO-236-3, SC-59, SOT-23-3

Forward Voltage :

800mV

Published :

2011

HTS Code :

8541.10.00.70

Output Current-Max :

0.2A

Number of Elements :

1

ECCN Code :

EAR99

Operating Temperature - Junction :

150°C Max

Base Part Number :

BAT54

Terminal Finish :

Tin (Sn)

Max Forward Surge Current (Ifsm) :

600mA

Number of Pins :

3

Diode Type :

Schottky

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Terminal Form :

Gull wing

Diode Element Material :

SILICON

Configuration :

Single

Reverse Recovery Time :

5ns

Max Repetitive Reverse Voltage (Vrrm) :

30V

Max Junction Temperature (Tj) :

150°C

Reverse Voltage :

30V

Number of Terminations :

3

Terminal Position :

Dual

Voltage - Forward (Vf) (Max) @ If :

800mV @ 100mA

Factory Lead Time :

4 Weeks

Current - Average Rectified (Io) :

200mA DC

Peak Reverse Current :

2µA

Capacitance @ Vr, F :

10pF @ 1V 1MHz

Surface Mount :

yes

JESD-609 Code :

e3

Height :

1.1mm

Packaging :

Tape and Reel (TR)