BAS56,235

Manufacturer :

NXP Semiconductors

Product Category :

Unclassified

Voltage - Forward (Vf) (Max) @ If :

1V @ 200mA

Surface Mount :

yes

Diode Element Material :

SILICON

RoHS Status :

ROHS3 Compliant

Terminal Finish :

Tin (Sn)

Speed :

Small Signal =< 200mA (Io), Any Speed

Packaging :

Tape and Reel (TR)

Diode Configuration :

2 Independent

Reverse Recovery Time :

6ns

Case Connection :

CATHODE

Mounting Type :

Surface Mount

Power Dissipation-Max :

0.25W

Base Part Number :

BAS56

Factory Lead Time :

4 Weeks

Qualification Status :

Not Qualified

Output Current-Max :

0.2A

Terminal Form :

Gull wing

ECCN Code :

EAR99

JESD-609 Code :

e3

Time@Peak Reflow Temperature-Max (s) :

40

Reverse Current-Max :

0.1μA

Rep Pk Reverse Voltage-Max :

60V

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

JESD-30 Code :

R-PDSO-G4

Number of Terminations :

4

Package / Case :

TO-253-4, TO-253AA

Pin Count :

4

Number of Elements :

2

Peak Reflow Temperature (Cel) :

260

Operating Temperature (Max) :

150°C

Non-rep Pk Forward Current-Max :

2A

Current - Reverse Leakage @ Vr :

100nA @ 120V

Current - Average Rectified (Io) :

200mA DC

HTS Code :

8541.10.00.80

Operating Temperature - Junction :

150°C Max

Terminal Position :

Dual

Diode Type :

Standard

Voltage - DC Reverse (Vr) (Max) :

60V