AX2000-1FGG1152M

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Mfr.Part #
AX2000-1FGG1152M
Manufacturer
Microchip Technology
Package / Case
1152-BGA
Datasheet
Download
Description
IC FPGA 684 I/O 1152FBGA
Stock
38,803
In Stock :
38,803

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Manufacturer :
Microchip Technology
Product Category :
FPGAs (Field Programmable Gate Array)
Time@Peak Reflow Temperature-Max (s) :
40
Peak Reflow Temperature (Cel) :
245
Number of Logic Elements/Cells :
21504
Width :
35mm
JESD-609 Code :
e1
Lifecycle Status :
IN PRODUCTION (Last Updated: 3 weeks ago)
RAM Size :
36KB
Published :
2005
Series :
Axcelerator
Number of Outputs :
684
Radiation Hardening :
No
Supply Voltage :
1.5V
RoHS Status :
RoHS Compliant
Mounting Type :
Surface Mount
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Terminal Position :
BOTTOM
Total RAM Bits :
294912
Number of Gates :
2000000
Operating Temperature :
-55°C~125°C TA
Operating Supply Voltage :
1.5V
Combinatorial Delay of a CLB-Max :
0.84 ns
Package / Case :
1152-BGA
Max Frequency :
763MHz
Packaging :
Tray
Screening Level :
MIL-STD-883 Class B
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Terminal Form :
Ball
Number of LABs/CLBs :
32256
Weight :
400.011771mg
Number of Pins :
1152
Number of I/O :
684
Length :
35mm
Speed Grade :
1
Factory Lead Time :
12 Weeks
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Base Part Number :
AX2000
Height :
1.73mm
Propagation Delay :
850 ps
Mount :
Surface Mount
Voltage - Supply :
1.425V~1.575V
Datasheets
AX2000-1FGG1152M
Introducing FPGAs (Field Programmable Gate Array) Microchip Technology AX2000-1FGG1152M from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:-55°C~125°C TA, Package / Case:1152-BGA, Number of Pins:1152, Base Part Number:AX2000, AX2000-1FGG1152M pinout, AX2000-1FGG1152M datasheet PDF, AX2000-1FGG1152M amp .Beyond FPGAs (Field Programmable Gate Array) Microchip Technology AX2000-1FGG1152M ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



1.5V V FPGAs Axcelerator Series 1152-BGA

AX2000-1FGG1152M Overview


In the package 1152-BGA, this product is provided. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 684 I/Os are programmed to ensure a more coherent data transfer. The basic building blocks of logic contain 21504 logic elements/cells. Supply voltage is 1.5V volts. By attaching the Surface Mount connector, you can use this FPGA module with your development board. With a supply voltage of 1.425V~1.575V, this device operates with ease. This is a type of FPGA that is part of the Axcelerator series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin -55°C~125°C TA when the device is operating. In this device, 684 outputs are incorporated in order to provide you with maximum flexibility. As a result of space limitations, this FPGA model has been included in Tray. Fpga electronics is worth mentioning that this device provides 294912 bfpga electronics s of RAM. AX2000 is the base part number that can be used to identify related parts. The RAM si36kBe of this FPGA module reaches 36kB so as to guarantee the normal operation of the program during operation. The device has 1152 pins which are included in the design. The FPGA is built as an array of 32256 latches or CLBs. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. In operation with 1.5V, designers can take advantage of its flexibility to the fullest extent. A basic building block for this type of building block consists of 2000000 gates. In fact, this FPGA is capable of reaching a speed of 763MHz.

AX2000-1FGG1152M Features


684 I/Os
Up to 294912 RAM bits
1152 LABs/CLBs


AX2000-1FGG1152M Applications


There are a lot of Microsemi Corporation
AX2000-1FGG1152M FPGAs applications.


  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
  • Consumer Electronics
  • Distributed Monetary Systems
  • Data Center
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