ATAR092O111-TKQWC1

Manufacturer :

Microchip Technology

Product Category :

RF Transceiver ICs

Protocol :

-

Current - Receiving :

-

Fastening Type :

Push-Pull

Termination :

Solder

Connector Type :

Header, Breakaway

Contact Finish - Post :

Tin

Style :

Board to Board or Cable

Insulation Material :

Liquid Crystal Polymer (LCP)

Mated Stacking Heights :

-

Current - Transmitting :

-

Frequency :

-

Insulation Color :

Black

Pitch - Mating :

0.100 (2.54mm)

Mounting Type :

Through Hole

Number of Rows :

1

Contact Length - Post :

0.120 (3.05mm)

Product Status :

Active

Contact Material :

COPPER ALLOY

Voltage - Supply :

1.8V ~ 6.5V

Number of Positions Loaded :

All

Series :

AMPMODU Mod II

Operating Temperature :

-65°C ~ 105°C

Power - Output :

-

Row Spacing - Mating :

-

Package / Case :

20-LSSOP (0.173, 4.40mm Width)

Package :

Bulk

Voltage Rating :

-

Current Rating (Amps) :

3A

Features :

-

RF Family/Standard :

-

Sensitivity :

-

Material Flammability Rating :

UL94 V-0

Contact Length - Mating :

0.230 (5.84mm)

Applications :

-

Contact Shape :

Square

Base Product Number :

146278

Shrouding :

Unshrouded

Contact Finish Thickness - Mating :

100.0µin (2.54µm)

Memory Size :

128B RAM, 4kB ROM

Contact Finish - Mating :

Tin

Contact Type :

Male Pin

Ingress Protection :

-

Number of Positions :

16

Modulation :

-

Serial Interfaces :

-

Supplier Device Package :

20-SSO

Overall Contact Length :

0.440 (11.18mm)

Contact Finish Thickness - Post :

100.0µin (2.54µm)

Type :

TxRx + MCU

Data Rate (Max) :

-

Insulation Height :

0.090 (2.29mm)