ASP-134485-01

Manufacturer :

Samtec, Inc.

Product Category :

Arrays, Edge Type, Mezzanine (Board to Board)

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Body Length or Diameter :

2.23 inch

Mixed Contacts :

No

ECCN Code :

EAR99

Contact Material :

Copper

Series :

ASP

Contact Finish Thickness :

30.0μin 0.76μm

Total Number of Contacts :

400

RoHS Status :

ROHS3 Compliant

Filter Feature :

No

Contact Finish :

Gold

Number Of PCB Rows :

10

REACH SVHC :

No SVHC

Insulation Material :

Liquid Crystal Polymer (LCP)

Packaging :

Strip

Radiation Hardening :

No

PCB Contact Row Spacing :

1.27 mm

Plating Thickness :

30μin

PCB Contact Pattern :

RECTANGULAR

Contact Pattern :

RECTANGULAR

Option :

GENERAL PURPOSE

Depth :

13.23mm

Reference Standard :

UL

Factory Lead Time :

3 Weeks

Orientation :

Straight

Number of Positions :

400

Gender :

Receptacle

Body Breadth :

0.521 inch

Reliability :

COMMERCIAL

Feature :

Board Guide

Termination :

Solder

Body/Shell Style :

Socket

Published :

2012

Connector Type :

High Density Array, Female

Number of Rows :

10

JESD-609 Code :

e3

HTS Code :

8536.69.40.40

Mating Contact Row Spacing :

0.05 inch

Pitch :

0.050 1.27mm

Number of Conductors :

ONE

Mounting Type :

Surface Mount

IEC Conformance :

No

Housing Color :

Black

MIL Conformance :

No

Height Above Board :

0.258 6.55mm

DIN Conformance :

No

Mounting Option 1 :

LOCKING

Contact Style :

SQ PIN-SKT