AS4C64M8D2-25BCN

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Mfr.Part #
AS4C64M8D2-25BCN
Manufacturer
Alliance Memory, Inc.
Package / Case
60-TFBGA
Datasheet
Download
Description
IC DRAM 512MBIT PARALLEL 60FBGA
Stock
34,469
In Stock :
34,469

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Manufacturer :
Alliance Memory, Inc.
Product Category :
Memory
Width :
8mm
Height Seated (Max) :
1.2mm
Length :
10mm
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Supply Voltage :
1.8V
Number of Terminations :
60
Additional Feature :
AUTO/SELF REFRESH
ECCN Code :
EAR99
Memory Format :
DRAM
Write Cycle Time - Word, Page :
15ns
Packaging :
Tray
Number of Ports :
1
Organization :
64MX8
Terminal Position :
BOTTOM
Surface Mount :
yes
Memory Density :
536870912 bit
JESD-30 Code :
R-PBGA-B60
Factory Lead Time :
8 Weeks
Memory Type :
Volatile
Memory Width :
8
Supply Voltage-Min (Vsup) :
1.7V
Number of Functions :
1
Operating Temperature :
0°C~70°C TA
Clock Frequency :
400MHz
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Size :
512Mb 64M x 8
Access Time :
400ps
RoHS Status :
ROHS3 Compliant
HTS Code :
8542.32.00.28
Package / Case :
60-TFBGA
Memory Interface :
Parallel
Supply Voltage-Max (Vsup) :
1.9V
Published :
2014
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Voltage - Supply :
1.7V~1.9V
Terminal Pitch :
0.8mm
Operating Mode :
SYNCHRONOUS
Mounting Type :
Surface Mount
Datasheets
AS4C64M8D2-25BCN
Introducing Memory Alliance Memory, Inc. AS4C64M8D2-25BCN from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:60, Operating Temperature:0°C~70°C TA, Package / Case:60-TFBGA, Mounting Type:Surface Mount, AS4C64M8D2-25BCN pinout, AS4C64M8D2-25BCN datasheet PDF, AS4C64M8D2-25BCN amp .Beyond Memory Alliance Memory, Inc. AS4C64M8D2-25BCN ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Alliance Memory, Inc. AS4C64M8D2-25BCN


Memory Alliance Memory, Inc. AS4C64M8D2-25BCN Overview

The AS4C64M8D2-25BCN by Alliance Memory, Inc. is a high-performance 512Mbit DRAM integrated circuit, designed to meet the rigorous demands of high-throughput applications. This memory module utilizes a parallel interface and is housed in a compact 60FBGA package, ensuring robust performance in a minimal footprint. As an essential component for data-intensive operations, the Memory Alliance Memory, Inc. AS4C64M8D2-25BCN offers reliability and speed, making it an ideal choice for manufacturers seeking to enhance their systems with efficient and scalable memory solutions.

AS4C64M8D2-25BCN Features

This DRAM IC excels in delivering essential features for advanced memory requirements:

  • Density: 512Mbit, providing substantial capacity for demanding applications.
  • Interface: Parallel, for rapid data transfer rates.
  • Package: 60FBGA, offering a compact footprint for space-constrained applications.
  • Operating Voltage: Low power consumption, which enhances overall system efficiency.

AS4C64M8D2-25BCN Applications

  • Consumer Electronics: Ideal for use in devices such as digital cameras and gaming consoles where high-speed memory is crucial for buffering and real-time data processing.
  • Mobile Devices: Provides the necessary memory bandwidth for smartphones and tablets, supporting advanced multitasking and high-performance applications.
  • Networking Hardware: Used in routers and switches to manage data flow efficiently across networks.
  • Automotive Systems: Suitable for automotive electronics where reliable and durable memory is essential for navigation and multimedia systems.
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