AS4C64M16D3LA-12BIN

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Mfr.Part #
AS4C64M16D3LA-12BIN
Manufacturer
Alliance Memory, Inc.
Package / Case
96-VFBGA
Datasheet
Download
Description
IC DRAM 1GBIT PARALLEL 96FBGA
Stock
11,528
In Stock :
11,528

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Manufacturer :
Alliance Memory, Inc.
Product Category :
Memory
Number of Functions :
1
Memory Interface :
Parallel
Terminal Position :
BOTTOM
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Length :
13mm
Packaging :
Tray
Operating Temperature :
-40°C~95°C TC
JESD-30 Code :
R-PBGA-B96
RoHS Status :
ROHS3 Compliant
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Operating Mode :
SYNCHRONOUS
Supply Voltage-Min (Vsup) :
1.283V
Number of Ports :
1
Memory Density :
1073741824 bit
Additional Feature :
AUTO/SELF REFRESH
Width :
8mm
Published :
2015
Access Time :
20ns
Surface Mount :
yes
Memory Width :
16
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Clock Frequency :
800MHz
Mounting Type :
Surface Mount
Package / Case :
96-VFBGA
Memory Type :
Volatile
Factory Lead Time :
8 Weeks
Supply Voltage :
1.35V
Pbfree Code :
yes
Organization :
64MX16
Terminal Pitch :
0.8mm
Number of Terminations :
96
Memory Format :
DRAM
Memory Size :
1Gb 64M x 16
Supply Voltage-Max (Vsup) :
1.45V
Voltage - Supply :
1.283V~1.45V
Height Seated (Max) :
1mm
Write Cycle Time - Word, Page :
15ns
Introducing Memory Alliance Memory, Inc. AS4C64M16D3LA-12BIN from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~95°C TC, Mounting Type:Surface Mount, Package / Case:96-VFBGA, Number of Terminations:96, AS4C64M16D3LA-12BIN pinout, AS4C64M16D3LA-12BIN datasheet PDF, AS4C64M16D3LA-12BIN amp .Beyond Memory Alliance Memory, Inc. AS4C64M16D3LA-12BIN ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Alliance Memory, Inc. AS4C64M16D3LA-12BIN


Memory Alliance Memory, Inc. AS4C64M16D3LA-12BIN Overview

The Memory Alliance Memory, Inc. AS4C64M16D3LA-12BIN DRAM offers an exceptional 1 Gbit density, engineered to meet the high standards of both performance and reliability. This integrated circuit features a 96FBGA package, optimizing both thermal management and space utilization in a wide range of applications. Designed with scalability in mind, it facilitates significant enhancements in system operations by increasing memory bandwidth and storage capacity, which is crucial for advanced computing systems. Its robust architecture makes it ideal for high-performance applications that require durable, continuous, and reliable memory solutions.

AS4C64M16D3LA-12BIN Features

This DRAM module is designed with a parallel interface, offering high-speed data transfer rates that are essential for real-time computing applications. The 96FBGA package not only ensures compactness but also enhances the thermal characteristics of the device, making it suitable for tightly packed system environments. The AS4C64M16D3LA-12BIN operates at a standard 1.2V, which allows for lower power consumption while maintaining high throughput and reliability.

AS4C64M16D3LA-12BIN Applications

  • Computing: Used in desktops, laptops, and servers where high capacity memory is crucial for multitasking and data-intensive applications.
  • Consumer Electronics: Integrated into devices such as smart TVs and gaming consoles, enhancing user experience through improved responsiveness and higher resolution graphics processing capabilities.
  • Networking: Deployed in routers and switches, facilitating faster data buffering and efficient handling of high-speed network traffic.
  • Industrial: Applied in automation systems and industrial PCs which require robust memory solutions to handle complex tasks and operate reliably in harsh environments.
  • Telecommunications: Essential for telecom equipment like base stations that require large amounts of memory for processing vast quantities of data and supporting multiple network interfaces and services.
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