AS4C64M16D2-25BINTR

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Mfr.Part #
AS4C64M16D2-25BINTR
Manufacturer
Alliance Memory, Inc.
Package / Case
84-TFBGA
Datasheet
Download
Description
IC DRAM 1GBIT PARALLEL 84TFBGA
Stock
26,534
In Stock :
26,534

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Manufacturer :
Alliance Memory, Inc.
Product Category :
Memory
Package / Case :
84-TFBGA
Operating Temperature :
-40°C~95°C TC
Terminal Pitch :
0.8mm
Mounting Type :
Surface Mount
Sequential Burst Length :
48
Memory Width :
16
Standby Current-Max :
0.01A
Memory Interface :
Parallel
Voltage - Supply :
1.7V~1.9V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Published :
2013
Interleaved Burst Length :
48
Memory Size :
1Gb 64M x 16
Operating Supply Voltage :
1.8V
Packaging :
Tape and Reel (TR)
Data Bus Width :
16b
Density :
1 Gb
Memory Format :
DRAM
Organization :
64MX16
Number of Terminations :
84
Access Time :
400ps
Terminal Position :
BOTTOM
Radiation Hardening :
No
Clock Frequency :
400MHz
I/O Type :
COMMON
Output Characteristics :
3-STATE
Write Cycle Time - Word, Page :
15ns
Memory Type :
Volatile
Surface Mount :
yes
RoHS Status :
RoHS Compliant
Refresh Cycles :
8192
Lead Free :
Lead Free
Number of Pins :
84
Factory Lead Time :
8 Weeks
Supply Voltage :
1.8V
Address Bus Width :
13b
Supply Current-Max :
0.33mA
Introducing Memory Alliance Memory, Inc. AS4C64M16D2-25BINTR from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:84-TFBGA, Operating Temperature:-40°C~95°C TC, Mounting Type:Surface Mount, Number of Terminations:84, Number of Pins:84, AS4C64M16D2-25BINTR pinout, AS4C64M16D2-25BINTR datasheet PDF, AS4C64M16D2-25BINTR amp .Beyond Memory Alliance Memory, Inc. AS4C64M16D2-25BINTR ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Alliance Memory, Inc. AS4C64M16D2-25BINTR


Memory Alliance Memory, Inc. AS4C64M16D2-25BINTR Overview

The Memory Alliance Memory, Inc. AS4C64M16D2-25BINTR is a high-performance 1Gbit DRAM chip designed for a variety of demanding applications. Manufactured by Alliance Memory, Inc., this IC provides robust parallel interface options, housed in an efficient 84TFBGA package for superior thermal and mechanical performance. The device is engineered to deliver high-speed data transfer and low-power operation, making it ideal for advanced computing and digital processing needs. With its vast storage capability and reliable performance, this Memory product is tailored to meet the rigorous requirements of today's sophisticated electronics.

AS4C64M16D2-25BINTR Features

  • High Capacity: 1Gbit of memory ensures ample space for complex applications.
  • Efficient Packaging: The 84TFBGA package is designed for compact, efficient layout and excellent thermal properties.
  • Parallel Interface: Allows for quick data transfer rates that are essential for high-performance computing tasks.
  • Low Power Consumption: Engineered to utilize minimal power, enhancing overall device efficiency and longevity.

AS4C64M16D2-25BINTR Applications

  • Consumer Electronics: Ideal for use in smartphones, tablets, and other portable devices where high memory density and speed are necessary.
  • Computing: Serves as system memory in personal computers and servers, facilitating fast processing and efficient multitasking.
  • Automotive Systems: Can be integrated into advanced driver-assistance systems (ADAS) for real-time processing and data storage.
  • Industrial Automation: Suitable for use in complex industrial machinery requiring rapid access to large amounts of data for process control and automation tasks.
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Shipping Method

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Shipping Cost

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