APA750-FG676

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Mfr.Part #
APA750-FG676
Manufacturer
Microsemi
Package / Case
676-BGA
Datasheet
Download
Description
IC FPGA 454 I/O 676FBGA
Stock
23,442
In Stock :
23,442

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Manufacturer :
Microsemi
Product Category :
FPGAs (Field Programmable Gate Array)
Width :
27mm
Height :
1.73mm
Mounting Type :
Surface Mount
RAM Size :
18kb
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Mount :
Surface Mount
Operating Supply Voltage :
2.5V
Terminal Finish :
Tin/Lead (Sn/Pb)
Number of I/O :
454
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of Gates :
750000
Factory Lead Time :
16 Weeks
Operating Temperature :
0°C~70°C TA
Power Supplies :
2.52.5/3.3V
Package / Case :
676-BGA
Published :
2009
Series :
ProASICPLUS
Number of Outputs :
454
Radiation Hardening :
No
Supply Voltage :
2.5V
Length :
27mm
Number of Pins :
676
RoHS Status :
Non-RoHS Compliant
Total RAM Bits :
147456
Packaging :
Tray
Peak Reflow Temperature (Cel) :
225
Base Part Number :
APA750
Weight :
400.011771mg
Frequency :
180MHz
Terminal Position :
BOTTOM
Terminal Form :
Ball
Voltage - Supply :
2.3V~2.7V
JESD-609 Code :
e0
Number of Registers :
32768
Number of Terminations :
676
Terminal Pitch :
1mm
Lifecycle Status :
OBSOLETE (Last Updated: 3 weeks ago)
HTS Code :
8542.39.00.01
Time@Peak Reflow Temperature-Max (s) :
30
Datasheets
APA750-FG676
Introducing FPGAs (Field Programmable Gate Array) Microsemi APA750-FG676 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:0°C~70°C TA, Package / Case:676-BGA, Number of Pins:676, Base Part Number:APA750, Number of Terminations:676, APA750-FG676 pinout, APA750-FG676 datasheet PDF, APA750-FG676 amp .Beyond FPGAs (Field Programmable Gate Array) Microsemi APA750-FG676 ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Microsemi APA750-FG676


FPGAs Microsemi APA750-FG676 Overview

Introducing the APA750-FG676 from Microsemi, a high-performance FPGA (Field Programmable Gate Array) that combines versatility with high-speed functionality. This FPGA is designed to cater to the demands of complex digital processing applications and is packaged in a 676FBGA format that allows for robust integration in various device architectures. The APA750-FG676 is an excellent choice for designers looking for a mix of high I/O capability, memory integrity, and computational power. With its extensive I/O options and substantial logic density, this FPGAs Microsemi APA750-FG676 is engineered to push the boundaries of technological innovation while optimizing system performance.

APA750-FG676 Features

The APA750-FG676 FPGA boasts an impressive array of features that make it a go-to solution for high-demand applications. It provides 454 I/O pins, allowing extensive connectivity and interfacing options. Housed in a compact 676-pin FBGA package, it ensures efficient space utilization and high-speed signal processing. This chip is built for adaptability and scalability, facilitating a wide range of digital processing tasks with ease and efficiency.

APA750-FG676 Applications

  • Telecommunications: Utilized in network infrastructure to manage data flow and signal processing, enhancing communication speed and reliability.
  • Aerospace and Defense: Employed in avionics for control systems and navigation, providing robust computing power and reliability under extreme conditions.
  • Automotive: Integral in advanced driver-assistance systems (ADAS) for processing real-time data from sensors and cameras, improving vehicle safety and performance.
  • Industrial Automation: Used in machine control units for real-time control and monitoring, ensuring high precision and efficiency in manufacturing processes.
  • Consumer Electronics: Embedded in devices such as high-definition televisions and gaming consoles, enhancing user experience through superior graphic and processing capabilities.
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